Skip to main navigation Skip to search Skip to main content

Modeling and simulation of transverse flux-based induction heating in transverse seal of packaging machine

  • Lei Li
  • , Shi Gang Wang*
  • , Jin Qiu Mo
  • , Xiao Hui Wei
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Due to the issue of temperature distribution of transverse sealing in packaging machine, the temperature field of induction heating was analyzed through numerical modeling and calculation. Based on the principle of transverse flux induction, the equations and boundary conditions of the electromagnetic field and the temperature field were deduced. The process of transverse seal and the structure of aluminum-polyethylene composite package materials were considered. Furthermore, the mathematic and the finite element models of electromagnetic field and temperature field that apply to the transverse sealing of packaging machine were established. Using the finite element software ANSYS, the eddy current field and the temperature field were animated. By analyzing the temperature distribution of different directions in the seal-section of the package material, the simulation results show that the temperature distribution in the actual conditions meets the qualification of transverse seal and provide practical references for engineering application.

Original languageEnglish
Pages (from-to)831-836+841
JournalShanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University
Volume45
Issue number6
StatePublished - Jun 2011
Externally publishedYes

Keywords

  • Eddy current field
  • Packaging machine
  • Temperature field
  • Transverse flux induction heating
  • Transverse seal

Fingerprint

Dive into the research topics of 'Modeling and simulation of transverse flux-based induction heating in transverse seal of packaging machine'. Together they form a unique fingerprint.

Cite this