Abstract
Hard nanocomposite Ti-Si-N films were deposited on 321 stainless steel substrate by direct current (DC) reactive magnetron sputtering using a Ti-Si mosaic target consisting of a Ti plate and Si chips. The composition, microstructure and mechanical properties were investigated using EDX, XRD, XPS, AFM, nano-indentation and scratch test. The results indicate that the hardness of Ti-Si-N gradually rises with the increasing Si contents in the layer until the peak value of 42 GPa appears corresponding to the Si content of 11.2%. The hardness then decreases with further increasing of the Si content. XRD, XPS, and AFM reveal that the hardest Ti-Si-N film consists of fine TiN crystallites (approximately 8 nm in size) surrounded by amorphous Si3N4. The preferential growth of TiN is indicated in the XRD patterns. All the Ti-Si-N films show high adhesive strength indicated by the scratch tests. The strengthening mechanism of such nanocomposite films was also discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 452-456 |
| Number of pages | 5 |
| Journal | Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University |
| Volume | 41 |
| Issue number | 3 |
| State | Published - Mar 2007 |
Keywords
- Adhesive strength
- Microstructure
- Nanohardness
- Ti-Si-N nanocomposite film
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