Microstructure and mechanical properties of Ti-Si-N nanocomposite coating prepared by DC magnetron sputtering

  • Ye Xu*
  • , Liu He Li
  • , Xun Cai
  • , Qiu Long Chen
  • , Paul K. Chu
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Hard nanocomposite Ti-Si-N films were deposited on 321 stainless steel substrate by direct current (DC) reactive magnetron sputtering using a Ti-Si mosaic target consisting of a Ti plate and Si chips. The composition, microstructure and mechanical properties were investigated using EDX, XRD, XPS, AFM, nano-indentation and scratch test. The results indicate that the hardness of Ti-Si-N gradually rises with the increasing Si contents in the layer until the peak value of 42 GPa appears corresponding to the Si content of 11.2%. The hardness then decreases with further increasing of the Si content. XRD, XPS, and AFM reveal that the hardest Ti-Si-N film consists of fine TiN crystallites (approximately 8 nm in size) surrounded by amorphous Si3N4. The preferential growth of TiN is indicated in the XRD patterns. All the Ti-Si-N films show high adhesive strength indicated by the scratch tests. The strengthening mechanism of such nanocomposite films was also discussed.

Original languageEnglish
Pages (from-to)452-456
Number of pages5
JournalShanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University
Volume41
Issue number3
StatePublished - Mar 2007

Keywords

  • Adhesive strength
  • Microstructure
  • Nanohardness
  • Ti-Si-N nanocomposite film

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