Microstructure and high through-thickness thermal conductivity of graphite fiber composite for structural applications

Ayou Hao; Shaokai Wang; Ming Chia Yang; J. G. Park; Jerry Horne; Richard Liang; Joseph H. Koo

doi:10.2514/6.2015-0123

Microstructure and high through-thickness thermal conductivity of graphite fiber composite for structural applications

Ayou Hao
, Shaokai Wang
, Ming Chia Yang
, J. G. Park
, Jerry Horne
, Richard Liang^*
, Joseph H. Koo

^*Corresponding author for this work

High-Performance Materials Institute, Florida State University
KAI, LLC

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Combinations of nanoscale and microscale silver particles were used to construct heterogeneously conductive paths in graphite composites for improving through-thickness thermal conductivity. Composites with four different pitch-based graphite fibers were studied and compared to realize the improved thermal conductivity with adequate mechanical performance. The test panels of EWC300X graphite fibers and sliver fillers achieved a through-thickness thermal conductivity of ∼10.0 W/m·K at 25 °C. The rheological behavior of Epon862/curing agent resin and silver flakes filled Epon862/curing agent resin was studied for the standardization and quality control of large panel fabrication. By adding 40wt% silver flakes in the resin system, the viscosity greatly increased. The lowest viscosity of 40% silver flakes filled Epon862/curing agent resin system occurred at 65 °C; therefore, the curing process was modified accordingly to ensure resin/fiber wetting and reduction of voids. The hybrid composites with IM7 and pitch-based carbon fiber were also made in order to optimize the composite performance with a balanced thermal conductivity and mechanical properties. The failure mechanisms of laminated composites with and without silver fillers were investigated. The IM7/EWC300X hybrid composite with a density of 2.31 g/cm³ showed a thermal conductivity of 5.29 W/ m·K and adequate mechanical properties for structural applications.

Original language	English
Title of host publication	56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
Publisher	American Institute of Aeronautics and Astronautics Inc.
ISBN (Electronic)	9781624103421
DOIs	https://doi.org/10.2514/6.2015-0123
State	Published - 2015
Externally published	Yes
Event	56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference 2015 - Kissimmee, United States Duration: 5 Jan 2015 → 9 Jan 2015

Publication series

Name	56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference

Conference

Conference	56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference 2015
Country/Territory	United States
City	Kissimmee
Period	5/01/15 → 9/01/15

Access to Document

10.2514/6.2015-0123

Cite this

Hao, A., Wang, S., Yang, M. C., Park, J. G., Horne, J., Liang, R., & Koo, J. H. (2015). Microstructure and high through-thickness thermal conductivity of graphite fiber composite for structural applications. In 56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference (56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference). American Institute of Aeronautics and Astronautics Inc.. https://doi.org/10.2514/6.2015-0123

Hao, Ayou ; Wang, Shaokai ; Yang, Ming Chia et al. / Microstructure and high through-thickness thermal conductivity of graphite fiber composite for structural applications. 56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference. American Institute of Aeronautics and Astronautics Inc., 2015. (56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference).

@inproceedings{8a764f72faa2406db2a429ded11e2d96,

title = "Microstructure and high through-thickness thermal conductivity of graphite fiber composite for structural applications",

abstract = "Combinations of nanoscale and microscale silver particles were used to construct heterogeneously conductive paths in graphite composites for improving through-thickness thermal conductivity. Composites with four different pitch-based graphite fibers were studied and compared to realize the improved thermal conductivity with adequate mechanical performance. The test panels of EWC300X graphite fibers and sliver fillers achieved a through-thickness thermal conductivity of ∼10.0 W/m·K at 25 °C. The rheological behavior of Epon862/curing agent resin and silver flakes filled Epon862/curing agent resin was studied for the standardization and quality control of large panel fabrication. By adding 40wt\% silver flakes in the resin system, the viscosity greatly increased. The lowest viscosity of 40\% silver flakes filled Epon862/curing agent resin system occurred at 65 °C; therefore, the curing process was modified accordingly to ensure resin/fiber wetting and reduction of voids. The hybrid composites with IM7 and pitch-based carbon fiber were also made in order to optimize the composite performance with a balanced thermal conductivity and mechanical properties. The failure mechanisms of laminated composites with and without silver fillers were investigated. The IM7/EWC300X hybrid composite with a density of 2.31 g/cm3 showed a thermal conductivity of 5.29 W/ m·K and adequate mechanical properties for structural applications.",

author = "Ayou Hao and Shaokai Wang and Yang, \{Ming Chia\} and Park, \{J. G.\} and Jerry Horne and Richard Liang and Koo, \{Joseph H.\}",

note = "Publisher Copyright: {\textcopyright} 2015, American Institute of Aeronautics and Astronautics Inc. All Rights Reserved.; 56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference 2015 ; Conference date: 05-01-2015 Through 09-01-2015",

year = "2015",

doi = "10.2514/6.2015-0123",

language = "英语",

series = "56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference",

publisher = "American Institute of Aeronautics and Astronautics Inc.",

booktitle = "56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference",

}

Hao, A, Wang, S, Yang, MC, Park, JG, Horne, J, Liang, R & Koo, JH 2015, Microstructure and high through-thickness thermal conductivity of graphite fiber composite for structural applications. in 56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference. 56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, American Institute of Aeronautics and Astronautics Inc., 56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference 2015, Kissimmee, United States, 5/01/15. https://doi.org/10.2514/6.2015-0123

Microstructure and high through-thickness thermal conductivity of graphite fiber composite for structural applications. / Hao, Ayou; Wang, Shaokai; Yang, Ming Chia et al.
56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference. American Institute of Aeronautics and Astronautics Inc., 2015. (56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Microstructure and high through-thickness thermal conductivity of graphite fiber composite for structural applications

AU - Hao, Ayou

AU - Wang, Shaokai

AU - Yang, Ming Chia

AU - Park, J. G.

AU - Horne, Jerry

AU - Liang, Richard

AU - Koo, Joseph H.

PY - 2015

Y1 - 2015

N2 - Combinations of nanoscale and microscale silver particles were used to construct heterogeneously conductive paths in graphite composites for improving through-thickness thermal conductivity. Composites with four different pitch-based graphite fibers were studied and compared to realize the improved thermal conductivity with adequate mechanical performance. The test panels of EWC300X graphite fibers and sliver fillers achieved a through-thickness thermal conductivity of ∼10.0 W/m·K at 25 °C. The rheological behavior of Epon862/curing agent resin and silver flakes filled Epon862/curing agent resin was studied for the standardization and quality control of large panel fabrication. By adding 40wt% silver flakes in the resin system, the viscosity greatly increased. The lowest viscosity of 40% silver flakes filled Epon862/curing agent resin system occurred at 65 °C; therefore, the curing process was modified accordingly to ensure resin/fiber wetting and reduction of voids. The hybrid composites with IM7 and pitch-based carbon fiber were also made in order to optimize the composite performance with a balanced thermal conductivity and mechanical properties. The failure mechanisms of laminated composites with and without silver fillers were investigated. The IM7/EWC300X hybrid composite with a density of 2.31 g/cm3 showed a thermal conductivity of 5.29 W/ m·K and adequate mechanical properties for structural applications.

AB - Combinations of nanoscale and microscale silver particles were used to construct heterogeneously conductive paths in graphite composites for improving through-thickness thermal conductivity. Composites with four different pitch-based graphite fibers were studied and compared to realize the improved thermal conductivity with adequate mechanical performance. The test panels of EWC300X graphite fibers and sliver fillers achieved a through-thickness thermal conductivity of ∼10.0 W/m·K at 25 °C. The rheological behavior of Epon862/curing agent resin and silver flakes filled Epon862/curing agent resin was studied for the standardization and quality control of large panel fabrication. By adding 40wt% silver flakes in the resin system, the viscosity greatly increased. The lowest viscosity of 40% silver flakes filled Epon862/curing agent resin system occurred at 65 °C; therefore, the curing process was modified accordingly to ensure resin/fiber wetting and reduction of voids. The hybrid composites with IM7 and pitch-based carbon fiber were also made in order to optimize the composite performance with a balanced thermal conductivity and mechanical properties. The failure mechanisms of laminated composites with and without silver fillers were investigated. The IM7/EWC300X hybrid composite with a density of 2.31 g/cm3 showed a thermal conductivity of 5.29 W/ m·K and adequate mechanical properties for structural applications.

UR - https://www.scopus.com/pages/publications/85085845957

U2 - 10.2514/6.2015-0123

DO - 10.2514/6.2015-0123

M3 - 会议稿件

AN - SCOPUS:85085845957

T3 - 56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference

BT - 56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference

PB - American Institute of Aeronautics and Astronautics Inc.

T2 - 56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference 2015

Y2 - 5 January 2015 through 9 January 2015

ER -

Hao A, Wang S, Yang MC, Park JG, Horne J, Liang R et al. Microstructure and high through-thickness thermal conductivity of graphite fiber composite for structural applications. In 56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference. American Institute of Aeronautics and Astronautics Inc. 2015. (56th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference). doi: 10.2514/6.2015-0123

Microstructure and high through-thickness thermal conductivity of graphite fiber composite for structural applications

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