Microstructure and deposition mechanism of electrodeposited Cu/liquid microcapsule composite

The nanostructured copper/microcapsule containing liquid core materials composite (copper/liquid microcapsules composite) was prepared using direct current (DC) electrodeposition method. The surface morphology and microstructure of composite were investigated by means of scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffraction (XRD). The results show that the microstructure of electrodeposited layer transformed from bulk crystal to nano structure because of the participation of microcapsules. The diameters of microcapsules and the copper grain sizes in the composite were 2-20 μm and 10-20 nm, respectively. In addition, the electrodeposition mechanism of composite in the deposition process followed electrochemistry theory, which was proved by the theoretical analysis result and the experiment results. Meanwhile, the co-deposition process model was presented.