Abstract
The microporous corrosion is the main surface failure mechanism of gold-plated components. The microporous corrosion behavior of electroless nickel and immersion gold (ENIG)-plated printed circuit boards (PCBs) in Turpan area which has an atmospheric environment with high salinity was investigated via a field exposure method for 24 months, as well as 3D analysis, FIB technology, composition analysis, and electrochemical impedance spectroscopy and corrosion mechanism model. After 6 months of exposure, the corrosion products filled up the pores and clustered on the surface as mound shape, and a possible corrosion mechanism model was displayed in the study after 24 months of exposure. The results showed that PCB-ENIG mainly suffered microporous corrosion in a high salinity atmospheric environment. The pores on the gold-plated coating were location where corrosion occurred first and the corrosion products were mostly oxides, chlorides, sulfates and carbonates of copper and nickle.
| Original language | English |
|---|---|
| Pages (from-to) | 8877-8885 |
| Number of pages | 9 |
| Journal | Journal of Materials Science: Materials in Electronics |
| Volume | 29 |
| Issue number | 11 |
| DOIs | |
| State | Published - 1 Jun 2018 |
| Externally published | Yes |
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