Micro-bridge Testing of Silicon Oxide Material

Zhang Haixia; Wang Yu; Zhang Taihua; Lu Deren

Micro-bridge Testing of Silicon Oxide Material

Zhang Haixia^*
, Wang Yu
, Zhang Taihua
, Lu Deren

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The present work put forward a micro-bridge testing for silicon oxide thin film. The principle of the micro-bridge testing method was introduced briefly, which is used to characterize mechanical properties of thin film. The micro bridge sample are prepared by the micromechanical fabrication technique, its process was presented in the paper. The present work shows that the Young's modulus, residuals stress for the heated oxide-Si0₂ are 53±15GPa, -0.15±20%GPa, respectively.

Original language	English
Title of host publication	Proceedings of the International Symposium on Test and Measurement
Pages	21-24
Number of pages	4
State	Published - 2003
Externally published	Yes

Publication series

Name	Proceedings of the International Symposium on Test and Measurement
Volume	1

Keywords

Mechanical performance
Residual Stress
SiO
Young's Modulus

Cite this

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title = "Micro-bridge Testing of Silicon Oxide Material",

abstract = "The present work put forward a micro-bridge testing for silicon oxide thin film. The principle of the micro-bridge testing method was introduced briefly, which is used to characterize mechanical properties of thin film. The micro bridge sample are prepared by the micromechanical fabrication technique, its process was presented in the paper. The present work shows that the Young's modulus, residuals stress for the heated oxide-Si02 are 53±15GPa, -0.15±20\%GPa, respectively.",

keywords = "Mechanical performance, Residual Stress, SiO, Young's Modulus",

author = "Zhang Haixia and Wang Yu and Zhang Taihua and Lu Deren",

year = "2003",

language = "英语",

series = "Proceedings of the International Symposium on Test and Measurement",

pages = "21--24",

booktitle = "Proceedings of the International Symposium on Test and Measurement",

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TY - GEN

T1 - Micro-bridge Testing of Silicon Oxide Material

AU - Haixia, Zhang

AU - Yu, Wang

AU - Taihua, Zhang

AU - Deren, Lu

PY - 2003

Y1 - 2003

N2 - The present work put forward a micro-bridge testing for silicon oxide thin film. The principle of the micro-bridge testing method was introduced briefly, which is used to characterize mechanical properties of thin film. The micro bridge sample are prepared by the micromechanical fabrication technique, its process was presented in the paper. The present work shows that the Young's modulus, residuals stress for the heated oxide-Si02 are 53±15GPa, -0.15±20%GPa, respectively.

AB - The present work put forward a micro-bridge testing for silicon oxide thin film. The principle of the micro-bridge testing method was introduced briefly, which is used to characterize mechanical properties of thin film. The micro bridge sample are prepared by the micromechanical fabrication technique, its process was presented in the paper. The present work shows that the Young's modulus, residuals stress for the heated oxide-Si02 are 53±15GPa, -0.15±20%GPa, respectively.

KW - Mechanical performance

KW - Residual Stress

KW - SiO

KW - Young's Modulus

UR - https://www.scopus.com/pages/publications/0141648390

M3 - 会议稿件

AN - SCOPUS:0141648390

T3 - Proceedings of the International Symposium on Test and Measurement

SP - 21

EP - 24

BT - Proceedings of the International Symposium on Test and Measurement

ER -

Micro-bridge Testing of Silicon Oxide Material

Abstract

Publication series

Keywords

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