@inproceedings{6061dda2c14847a58d718cdcd5690dff,
title = "Mechanism simulation of integrated circuit interconnection electromigration failure",
abstract = "The existing life prediction model does not reflect the degradation law of the electrical properties of the interconnect during electromigration process, so there are great limitations in its practical application. This research developed a new failure mechanism degradation model to describe the law of the interconnect performance degradation in the process of electromigration. This paper takes operational amplifier as an example to achieve the failure mechanism injection of the integrated circuit. Through the simulation, this paper shows how the response characteristics of all the measurable signal nodes of the integrated circuit changes with the occurrence and development of electromigration, and meanwhile provides technical support for circuit fault diagnosis and prediction.",
keywords = "Circuit fault simulation, Electro migration, Failure mechanism injection, Failure model",
author = "Yuna Liu and Hu, \{Wei Wei\} and Ma, \{Xiao Li\}",
year = "2016",
language = "英语",
series = "Conference Proceedings of the 4th International Symposium on Project Management, ISPM 2016",
publisher = "Aussino Academic Publishing House",
pages = "468--473",
editor = "Cao, \{Xi Shen\} and Henry Zhang and Cheng, \{Chang Bo\}",
booktitle = "Conference Proceedings of the 4th International Symposium on Project Management, ISPM 2016",
note = "4th International Symposium on Project Management, ISPM 2016 ; Conference date: 09-07-2016 Through 10-07-2016",
}