Abstract
In this paper, Cu@Ag was coated on biological particles (diatomite and spirulina) by electroless plating to manufacture bio-based core-shell-type conductive particles. The shape appearance, surface morphology, coating composition and conductivity of Cu@Ag-coated diatomite/spirulina were characterized by optical microscopy, scanning electron microscopy, energy dispersive spectrometer and SZT-2A-type four-probe tester. The results show that, high quality bio-type conductive particles surface can be made by adjusting the proportion of electroless copper plating solution and electroless silver plating solution. The density of bio-type conductive particles was much lower than that of the pure metal powder.
| Original language | English |
|---|---|
| Pages (from-to) | 19109-19114 |
| Number of pages | 6 |
| Journal | Gongneng Cailiao/Journal of Functional Materials |
| Volume | 45 |
| Issue number | 19 |
| DOIs | |
| State | Published - 15 Oct 2014 |
Keywords
- Chemistry plating Cu@Ag
- Conductivity
- Diatomite
- Plating solution ratio
- Spirulina
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