Magnetoresistance in the hard/Cu/soft sandwiches: Dependence on layer thickness and field annealing

Bai Yang; Xiaofang Bi; Fan Yang; Shengkai Gong; Huibin Xu

doi:10.4028/0-87849-960-1.2211

Magnetoresistance in the hard/Cu/soft sandwiches: Dependence on layer thickness and field annealing

Bai Yang^*
, Xiaofang Bi
, Fan Yang
, Shengkai Gong
, Huibin Xu

^*Corresponding author for this work

School of Materials Science and Engineering

Beihang University

Research output: Contribution to journal › Conference article › peer-review

Abstract

NiFe(2nm)/Cu(t_Cu)/Co(1.5nm) sandwiches were deposited on Ta buffer layer by magnetron sputtering method. Small angle X-ray diffraction analysis was made to investigate the structural characterizations of the sandwiches. It has been obtained that MR value showed a maximum at t _Cu=2nm when Cu spacer thickness changed, which is contributed by the effect of shutting and interlayer coupling. The Cu layer was deposited at two different rates. Larger MR ratio was observed with a lower deposition rate. The result was discussed in terms of magnetic reversal fields. In addition, the sandwiches were subjected to field annealing at different annealing temperatures. MR ratio has exhibited a largest increase after annealing at 175°C with a magnetic field of 7500e applied.

Original language	English
Pages (from-to)	2211-2214
Number of pages	4
Journal	Materials Science Forum
Volume	475-479
Issue number	III
DOIs	https://doi.org/10.4028/0-87849-960-1.2211
State	Published - 2005
Event	PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing - Beijing, China Duration: 2 Nov 2004 → 5 Nov 2004

Keywords

Field annealing
Interlayer coupling
Layer thickness
Magnetoresistance

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10.4028/0-87849-960-1.2211

Cite this

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title = "Magnetoresistance in the hard/Cu/soft sandwiches: Dependence on layer thickness and field annealing",

abstract = "NiFe(2nm)/Cu(tCu)/Co(1.5nm) sandwiches were deposited on Ta buffer layer by magnetron sputtering method. Small angle X-ray diffraction analysis was made to investigate the structural characterizations of the sandwiches. It has been obtained that MR value showed a maximum at t Cu=2nm when Cu spacer thickness changed, which is contributed by the effect of shutting and interlayer coupling. The Cu layer was deposited at two different rates. Larger MR ratio was observed with a lower deposition rate. The result was discussed in terms of magnetic reversal fields. In addition, the sandwiches were subjected to field annealing at different annealing temperatures. MR ratio has exhibited a largest increase after annealing at 175°C with a magnetic field of 7500e applied.",

keywords = "Field annealing, Interlayer coupling, Layer thickness, Magnetoresistance",

author = "Bai Yang and Xiaofang Bi and Fan Yang and Shengkai Gong and Huibin Xu",

year = "2005",

doi = "10.4028/0-87849-960-1.2211",

language = "英语",

volume = "475-479",

pages = "2211--2214",

journal = "Materials Science Forum",

issn = "0255-5476",

publisher = "Trans Tech Publications Ltd",

number = "III",

note = "PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing ; Conference date: 02-11-2004 Through 05-11-2004",

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TY - JOUR

T1 - Magnetoresistance in the hard/Cu/soft sandwiches

T2 - PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing

AU - Yang, Bai

AU - Bi, Xiaofang

AU - Yang, Fan

AU - Gong, Shengkai

AU - Xu, Huibin

PY - 2005

Y1 - 2005

N2 - NiFe(2nm)/Cu(tCu)/Co(1.5nm) sandwiches were deposited on Ta buffer layer by magnetron sputtering method. Small angle X-ray diffraction analysis was made to investigate the structural characterizations of the sandwiches. It has been obtained that MR value showed a maximum at t Cu=2nm when Cu spacer thickness changed, which is contributed by the effect of shutting and interlayer coupling. The Cu layer was deposited at two different rates. Larger MR ratio was observed with a lower deposition rate. The result was discussed in terms of magnetic reversal fields. In addition, the sandwiches were subjected to field annealing at different annealing temperatures. MR ratio has exhibited a largest increase after annealing at 175°C with a magnetic field of 7500e applied.

AB - NiFe(2nm)/Cu(tCu)/Co(1.5nm) sandwiches were deposited on Ta buffer layer by magnetron sputtering method. Small angle X-ray diffraction analysis was made to investigate the structural characterizations of the sandwiches. It has been obtained that MR value showed a maximum at t Cu=2nm when Cu spacer thickness changed, which is contributed by the effect of shutting and interlayer coupling. The Cu layer was deposited at two different rates. Larger MR ratio was observed with a lower deposition rate. The result was discussed in terms of magnetic reversal fields. In addition, the sandwiches were subjected to field annealing at different annealing temperatures. MR ratio has exhibited a largest increase after annealing at 175°C with a magnetic field of 7500e applied.

KW - Field annealing

KW - Interlayer coupling

KW - Layer thickness

KW - Magnetoresistance

UR - https://www.scopus.com/pages/publications/17044431470

U2 - 10.4028/0-87849-960-1.2211

DO - 10.4028/0-87849-960-1.2211

M3 - 会议文章

AN - SCOPUS:17044431470

SN - 0255-5476

VL - 475-479

SP - 2211

EP - 2214

JO - Materials Science Forum

JF - Materials Science Forum

IS - III

Y2 - 2 November 2004 through 5 November 2004

ER -

Magnetoresistance in the hard/Cu/soft sandwiches: Dependence on layer thickness and field annealing

Abstract

Keywords

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