@inproceedings{fccd897fc70c454ebbde85c4c6ff8614,
title = "Life Prediction of the Delaminations of SiP Based on Physics-of-Failure",
abstract = "The development of SiP chips has driven the lightweight trend in electronics, but it also brings new reliability issues, especially package delamination caused by compound stress. This paper proposes a method for predicting the layered lifetime of SiP chip packaging based on physics-of-failure model. Taking an energy SiP module and its key components as an example, this paper analyzes the mechanism and influencing factors of package layering failure in different parts of SiP chip during reflow welding process and use. Through physics-of-failure model, the life of SiP chip in packaging layering process and reflow welding process is predicted. This research is of great significance for identifying weak points in SiP chip and the improvement of the design method.",
keywords = "SiP, compound stress, life prediction, package delamination, physics-of-failure model",
author = "Jianan Zhang and Ying Chen and Shumin Li and Yingyi Li",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 5th International Conference on System Reliability and Safety Engineering, SRSE 2023 ; Conference date: 20-10-2023 Through 23-10-2023",
year = "2023",
doi = "10.1109/SRSE59585.2023.10336086",
language = "英语",
series = "2023 5th International Conference on System Reliability and Safety Engineering, SRSE 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "287--292",
booktitle = "2023 5th International Conference on System Reliability and Safety Engineering, SRSE 2023",
address = "美国",
}