Junction temperature measurement to optimize thermal design of LED arrays

Huaiyu Ye; Hongyu Tang; Stanley Leung; Cheng Qian; Xuejun Fan; Guoqi Zhang

doi:10.1109/SSLCHINA.2015.7360687

Junction temperature measurement to optimize thermal design of LED arrays

Huaiyu Ye
, Hongyu Tang
, Stanley Leung
, Cheng Qian
, Xuejun Fan
, Guoqi Zhang

Delft University of Technology
CAS - Institute of Semiconductors
Changzhou Institute of Technology Research for Solid State Lighting
Lamar University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.

Original language	English
Title of host publication	2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	47-51
Number of pages	5
ISBN (Electronic)	9781509001767
DOIs	https://doi.org/10.1109/SSLCHINA.2015.7360687
State	Published - 17 Dec 2015
Externally published	Yes
Event	12th China International Forum on Solid State Lighting, SSLCHINA 2015 - Shenzhen, China Duration: 2 Nov 2015 → 4 Nov 2015

Publication series

Name	2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015

Conference

Conference	12th China International Forum on Solid State Lighting, SSLCHINA 2015
Country/Territory	China
City	Shenzhen
Period	2/11/15 → 4/11/15

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10.1109/SSLCHINA.2015.7360687

Cite this

Ye, H., Tang, H., Leung, S., Qian, C., Fan, X., & Zhang, G. (2015). Junction temperature measurement to optimize thermal design of LED arrays. In 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015 (pp. 47-51). Article 7360687 (2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SSLCHINA.2015.7360687

@inproceedings{0dbf8f9da0504ad0bf5ec9213ce5a234,

title = "Junction temperature measurement to optimize thermal design of LED arrays",

abstract = "The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.",

author = "Huaiyu Ye and Hongyu Tang and Stanley Leung and Cheng Qian and Xuejun Fan and Guoqi Zhang",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 12th China International Forum on Solid State Lighting, SSLCHINA 2015 ; Conference date: 02-11-2015 Through 04-11-2015",

year = "2015",

month = dec,

day = "17",

doi = "10.1109/SSLCHINA.2015.7360687",

language = "英语",

series = "2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015",

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booktitle = "2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015",

address = "美国",

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Ye, H, Tang, H, Leung, S, Qian, C, Fan, X & Zhang, G 2015, Junction temperature measurement to optimize thermal design of LED arrays. in 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015., 7360687, 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015, Institute of Electrical and Electronics Engineers Inc., pp. 47-51, 12th China International Forum on Solid State Lighting, SSLCHINA 2015, Shenzhen, China, 2/11/15. https://doi.org/10.1109/SSLCHINA.2015.7360687

Junction temperature measurement to optimize thermal design of LED arrays. / Ye, Huaiyu; Tang, Hongyu; Leung, Stanley et al.
2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 47-51 7360687 (2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Junction temperature measurement to optimize thermal design of LED arrays

AU - Ye, Huaiyu

AU - Tang, Hongyu

AU - Leung, Stanley

AU - Qian, Cheng

AU - Fan, Xuejun

AU - Zhang, Guoqi

PY - 2015/12/17

Y1 - 2015/12/17

N2 - The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.

AB - The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.

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U2 - 10.1109/SSLCHINA.2015.7360687

DO - 10.1109/SSLCHINA.2015.7360687

M3 - 会议稿件

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T3 - 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015

SP - 47

EP - 51

BT - 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 12th China International Forum on Solid State Lighting, SSLCHINA 2015

Y2 - 2 November 2015 through 4 November 2015

ER -

Ye H, Tang H, Leung S, Qian C, Fan X, Zhang G. Junction temperature measurement to optimize thermal design of LED arrays. In 2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 47-51. 7360687. (2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015). doi: 10.1109/SSLCHINA.2015.7360687

Junction temperature measurement to optimize thermal design of LED arrays

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