Joining of high temperature superconducting BSCCO/Ag tapes

  • Guo Wei*
  • , Zou Guisheng
  • , Wu Aiping
  • , Ren Jialie
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

Abstract

High temperature superconducting BSCCO/Ag tapes have been fabricatedcommercially by PIT methods and many applications of the tapes need to join the tapes.There are several joining methods developed to implement the aim. Soldering technologyis conventional joining methods and the joint owns larger resistance. Somesuperconducting joining methods also have been put out. First of all, the cold-press andpost heat treatment technique according to the fabrication process of the tape is used tomade superconducting joint with hundreds of hours and the joint is of lowersuperconducting property. Second, Diffusion bonding without an interlayer (directly) orwith superconducting powders methods are developed to join the BSCCO/Ag tapes inshorter time, and these joints are of excellent superconducting properties comparing withthe cold-press and post heat treatment method.

Original languageEnglish
Title of host publicationSuperconductivity
Subtitle of host publicationTheory, Materials and Applications
PublisherNova Science Publishers, Inc.
Pages503-512
Number of pages10
ISBN (Print)9781613248430
StatePublished - Mar 2012

Keywords

  • Bi-2223/Ag
  • Diffusion bonding
  • Microstructures
  • Soldering

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