Interfacial adhesion and shear behaviors of aramid fiber/polyamide 6 composites under different thermal treatments

Aramid fiber (AF) reinforced by polyamide (PA) composites are excepted to have good interfacial matching due to their similar chemical interactions of hydrogen bonding. Thus, polarizing optical microscope (POM), transverse fiber bundle (TFB) test, and droplet micro-debonding technique were respectively performed to characterize interfacial crystallization, adhesion and shear behaviors of AF/PA6 composites with different thermal treatments. Both interface adhesion and AF fibrillation are enhanced with decreasing cooling rate or increasing annealing temperature due to the increased interfacial transcrystallization interaction. However, fast cooled interface also presents a high interfacial shear strength (IFSS) due to favorable normal residual stress. The apparent IFSS is believed to be a result of competition between crystallization enhancing interfacial interaction, interfacial mismatching aggravating debonding, and an uncertain residual stress positive or negative for load transfer. TFB failure mechanism including AF fibrillation and kinking are schematically presented. Fibrillation strength of AF is found to follow Weibull distribution evaluated by droplet micro-debonding technique.