Intercalating copper into layered TaS2 van der Waals gaps

  • Rui Liu
  • , Cong Wang
  • , Yuanyuan Li
  • , Yong Xie
  • , Qiang Chen
  • , Ziyu Chen*
  • , Qian Liu
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Since graphene was successfully exfoliated, intercalation has been reviewed from bulk materials to two-dimensional counterparts. Here 1T phase Cu-TaS2 was successfully prepared via intercalating Cu into 2D layered TaS2 based on a solution method, which cannot damage the crystal structure of the target material and can realize uniform intercalation with a large amount of dopants. The electrical conductivity of 2D TaS2 intercalated by Cu has an obvious increase compared with 2D TaS2. Considering the peculiar metal-insulator transitions (MITs) of TaS2, our work may provide new opportunities for future superconductor and CDW-based memory devices.

Original languageEnglish
Pages (from-to)46699-46703
Number of pages5
JournalRSC Advances
Volume7
Issue number74
DOIs
StatePublished - 2017

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