Abstract
A miniature integrable transformer is an obstacle to the miniaturization of packaged power supply on chip (PwrSoC). This letter introduces a through-silicon via (TSV) high-aspect-ratio toroidal transformer manufactured using microelectro-mechanical systems and electroplating. The primary coil and secondary coil of the transformer are interleaved on the toroidal core cavity, which is entirely wrapped in silicon, and a 1.2 mm high toroidal Ni-Zn ferrite core is formed. A 15:15 turn transformer is fabricated with a compact coil size of Φ4.1 × 2 mm with an aspect ratio (ratio of TSV depth to diameter) of 20. Measurements show that it has an inductance of 105 to 115 nH in a high frequency range of 1 to 80 MHz and a coupling coefficient of ∼0.7 in the range of 1 MHz to >15 MHz. Compared to that of the transformer without the Ni-Zn ferrite core, the coupling coefficient of the toroidal transformer increases by 40% with an inductance increase of 20%. At a frequency of 14 MHz, the transformer has a maximum quality factor of 16.7. The small size, IC compatible manufacturing process and excellent performance at high-frequency of the transformer proposed, meet the further integrated and miniaturized needs of PwrSoC.
| Original language | English |
|---|---|
| Pages (from-to) | 10075-10080 |
| Number of pages | 6 |
| Journal | IEEE Transactions on Power Electronics |
| Volume | 37 |
| Issue number | 9 |
| DOIs | |
| State | Published - 1 Sep 2022 |
Keywords
- Microelectro-mechanical systems (MEMS)
- Ni-Zn ferrite core
- microintegrated transformer
- packaged power supply on chip (PwrSoC)
- through-silicon via (TSV)
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