TY - GEN
T1 - Influence of stress on the electromigration life of solder
AU - Zhang, Zheng
AU - Liu, Qingyi
AU - Pan, Xiaoxu
AU - Wang, Qizhi
AU - Su, Fei
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/11/28
Y1 - 2016/11/28
N2 - It was suggested that electromigration (EM) life of solder can be improved by proper choice of stress property (compressive or tensile) at the two corners where electron current enter and exit. In this paper, we investigated this problem systematically by experiment and finite element simulation. The experimental results show that, compared with the case of tensile stress, the meantime to failure (MTTF) of solder will be slightly longer if the stress at the current entrance and exit are compressive. The finite elemental simulation results show that the arising rate of vacancy density at cathode corner will be the lowest if the stress here is compressive and the stress at anode corner is tensile, and the reverse is the worst case, while the other two cases as we verified in the experiment are intermediate. But in general, the differences in arising rate of vacancy density at cathode corner of solder and thus the influence of stress on electromigration life of solders are not obvious.
AB - It was suggested that electromigration (EM) life of solder can be improved by proper choice of stress property (compressive or tensile) at the two corners where electron current enter and exit. In this paper, we investigated this problem systematically by experiment and finite element simulation. The experimental results show that, compared with the case of tensile stress, the meantime to failure (MTTF) of solder will be slightly longer if the stress at the current entrance and exit are compressive. The finite elemental simulation results show that the arising rate of vacancy density at cathode corner will be the lowest if the stress here is compressive and the stress at anode corner is tensile, and the reverse is the worst case, while the other two cases as we verified in the experiment are intermediate. But in general, the differences in arising rate of vacancy density at cathode corner of solder and thus the influence of stress on electromigration life of solders are not obvious.
UR - https://www.scopus.com/pages/publications/85006014523
U2 - 10.1109/IEMT.2016.7761960
DO - 10.1109/IEMT.2016.7761960
M3 - 会议稿件
AN - SCOPUS:85006014523
T3 - Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
BT - 2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 37th IEEE International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016
Y2 - 20 September 2016 through 22 September 2016
ER -