TY - GEN
T1 - High sensitivity micro electrometer based on clamped free curved beams resonator with weakened nonlinearity
AU - Chen, Dongyang
AU - Liu, Xinxin
AU - Wang, Yong
AU - Xu, Zhonggui
AU - Lin, Hongyun
AU - Liu, Huicong
AU - Xie, Jin
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/24
Y1 - 2018/4/24
N2 - In this work, we report a high performance MEMS electrometer based on a clamped-free semi-circular beams (CFCB) resonator with a new sensing scheme of vibration perturbation. The CFCB resonator vibrating at elastic mode aims to eliminate the nonlinearity that widely exists in traditional double-ended tuning forks (DETF) sensors and lower the temperature coefficient of frequency. The charge sensing scheme of vibration perturbation has been realized by using the electric charge induced attractive electrostatic force to perturb the vibration of elastic mode and lead to a frequency modulation, which shows a sensitivity higher than the axial strain modulation scheme of DETF over one order of magnitude.
AB - In this work, we report a high performance MEMS electrometer based on a clamped-free semi-circular beams (CFCB) resonator with a new sensing scheme of vibration perturbation. The CFCB resonator vibrating at elastic mode aims to eliminate the nonlinearity that widely exists in traditional double-ended tuning forks (DETF) sensors and lower the temperature coefficient of frequency. The charge sensing scheme of vibration perturbation has been realized by using the electric charge induced attractive electrostatic force to perturb the vibration of elastic mode and lead to a frequency modulation, which shows a sensitivity higher than the axial strain modulation scheme of DETF over one order of magnitude.
UR - https://www.scopus.com/pages/publications/85046994541
U2 - 10.1109/MEMSYS.2018.8346750
DO - 10.1109/MEMSYS.2018.8346750
M3 - 会议稿件
AN - SCOPUS:85046994541
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1092
EP - 1095
BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
Y2 - 21 January 2018 through 25 January 2018
ER -