TY - GEN
T1 - Ground simulation method for envelope performance of airship in near space
AU - Liu, Long Bin
AU - Mi, Pan Pan
AU - Cao, Shuai
AU - Lv, Ming Yun
PY - 2014
Y1 - 2014
N2 - Performing characteristics on envelope composite of near space airship (NSA) are quite different from that of the low altitude airship essentially. The NSA envelope material should meet excellent applicative characteristics including light weight, high strength, anti-aging, anti-ultraviolet radiation, gas-tightness, weather resistance. Ground simulation test is critical for the envelope design and development process of NSA, and the environmental features of near space is analyzed for NSA, then corresponding ground simulation test methods are proposed to involve mechanical strength of the ground test methods among the changing weather temperature and over pressure changes, materials weather resistance and air tightness test. Finally the coupling relationship between various mechanical test and environmental test methods is also investigated.
AB - Performing characteristics on envelope composite of near space airship (NSA) are quite different from that of the low altitude airship essentially. The NSA envelope material should meet excellent applicative characteristics including light weight, high strength, anti-aging, anti-ultraviolet radiation, gas-tightness, weather resistance. Ground simulation test is critical for the envelope design and development process of NSA, and the environmental features of near space is analyzed for NSA, then corresponding ground simulation test methods are proposed to involve mechanical strength of the ground test methods among the changing weather temperature and over pressure changes, materials weather resistance and air tightness test. Finally the coupling relationship between various mechanical test and environmental test methods is also investigated.
KW - Ground simulation test
KW - Near space airship
KW - Performing environment
KW - The envelope material
KW - Weathering performance
UR - https://www.scopus.com/pages/publications/84905833551
U2 - 10.4028/www.scientific.net/AMR.989-994.3473
DO - 10.4028/www.scientific.net/AMR.989-994.3473
M3 - 会议稿件
AN - SCOPUS:84905833551
SN - 9783038351733
T3 - Advanced Materials Research
SP - 3473
EP - 3476
BT - Materials Science, Computer and Information Technology
PB - Trans Tech Publications Ltd
T2 - 4th International Conference on Materials Science and Information Technology, MSIT 2014
Y2 - 14 June 2014 through 15 June 2014
ER -