Abstract
The numerical simulation of residual stresses in the diffusion bonding joints of TC4/QA110-3-1.5 and TC4/Ni/QA110-3-1.5 is carried out by ANSYS. The σy,max impairing the joint strength appears in the narrow region between the intermetallic compounds and the TC4 side. With closing the center axis, the tensile stresses rapidly minish and gradually transform into compress stresses. So, it becomes a weak region of the joint. But the stress distribution is comparatively relaxative when using Ni as interlayer. The maximal residual stress appears on the intermetallic compounds of NiTi and Ni3Ti between Ni interlayer and TC4, correspondingly, the joint residual stress increases with the interlayer thickness increasing.
| Original language | English |
|---|---|
| Pages (from-to) | 1938-1941 |
| Number of pages | 4 |
| Journal | Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering |
| Volume | 36 |
| Issue number | 11 |
| State | Published - Nov 2007 |
| Externally published | Yes |
Keywords
- Diffusion bonding
- Finite element
- Ni interlayer
- QA110-3-1.5
- Residual stresses
- TC4
Fingerprint
Dive into the research topics of 'Finite element modeling of residual stresses in the diffusion bonding joints of TC4/QA110-3-1.5'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver