Skip to main navigation Skip to search Skip to main content

Finite element modeling of residual stresses in the diffusion bonding joints of TC4/QA110-3-1.5

  • Minxia Song*
  • , Xihua Zhao
  • , Da Huang
  • , Wei Guo
  • , Jicai Feng
  • , Huanling Zhao
  • *Corresponding author for this work
  • Jilin University
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

The numerical simulation of residual stresses in the diffusion bonding joints of TC4/QA110-3-1.5 and TC4/Ni/QA110-3-1.5 is carried out by ANSYS. The σy,max impairing the joint strength appears in the narrow region between the intermetallic compounds and the TC4 side. With closing the center axis, the tensile stresses rapidly minish and gradually transform into compress stresses. So, it becomes a weak region of the joint. But the stress distribution is comparatively relaxative when using Ni as interlayer. The maximal residual stress appears on the intermetallic compounds of NiTi and Ni3Ti between Ni interlayer and TC4, correspondingly, the joint residual stress increases with the interlayer thickness increasing.

Original languageEnglish
Pages (from-to)1938-1941
Number of pages4
JournalXiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
Volume36
Issue number11
StatePublished - Nov 2007
Externally publishedYes

Keywords

  • Diffusion bonding
  • Finite element
  • Ni interlayer
  • QA110-3-1.5
  • Residual stresses
  • TC4

Fingerprint

Dive into the research topics of 'Finite element modeling of residual stresses in the diffusion bonding joints of TC4/QA110-3-1.5'. Together they form a unique fingerprint.

Cite this