Field studies of corrosion behaviour of printed circuit board and hot air solder levelling during the marine environment of industrial pollution

The atmospheric corrosion behaviour of PCB-HASL (electronic materials) in a polluted marine atmosphere environment was investigated by stereology microscope, SEM, EIS, XPS and SKP. It was found that deposition of chloride ions and SO₂ gas played a pivotal role in atmospheric corrosion, which contributed to an obvious undulation of the corrosion rate. In the late exposure test, the expansion of the corrosion products gave rise to the abscission of the protective coating layer (Sn), which resulted in substrate Cu directly exposing to atmospheric environment of Xiaomai Island and causing the Cu gradually corrosion.