Fast growth of centimeter-scale single-crystal copper foils with high-index planes by the edge-incision effect

  • Li Li
  • , Teng Ma
  • , Wei Yu
  • , Menglong Zhu
  • , Jing Li
  • , Zhi Chen
  • , Haohan Li
  • , Meng Zhao
  • , Jinghua Teng
  • , Bingbing Tian
  • , Chenliang Su*
  • , Kian Ping Loh*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Single-crystal copper substrates have gained importance for the preparation of high-quality graphene and hexagonal boron nitride monolayer films by chemical vapor deposition (CVD). Especially, large-scale single-crystal copper foils with high-index planes are synthesized recently and attract great interests. However, the current synthesis methods of single-crystal copper foils and films are energy and time-consuming. Here, we show a rapid and efficient approach for the preparation of centimeter-scale single-crystal copper foils by making small incisions at the edges of polycrystalline copper foils before high-temperature annealing. 1.5 cm × 4 cm pieces of grain-boundary-free copper foils can be prepared by annealing at 1080 °C for 60 min. The annealed copper foil manifests a single high-index plane and is grain-boundary-free over the whole area. We also show that CVD of graphene on the high-index single-crystal copper affords a higher growth rate than on low-index copper substrates.

Original languageEnglish
Article number035019
Journal2D Materials
Volume8
Issue number3
DOIs
StatePublished - Jul 2021
Externally publishedYes

Keywords

  • Abnormal grain growth
  • High-index planes
  • High-temperature annealing
  • Incisions
  • Single-crystal copper foils

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