Abstract
Single-crystal silicon carbide (SiC)-based pressure sensors can be used in harsh environments, as they exhibit stable mechanical and electrical properties at elevated temperatures. A fiber-optic pressure sensor with an all-SiC sensor head was fabricated and is herein proposed. SiC sensor diaphragms were fabricated via an ultrasonic vibration mill-grinding (UVMG) method, which resulted in a small grinding force and low surface roughness. The sensor head was formed by hermetically bonding two layers of SiC using a nickel diffusion bonding method. The pressure sensor illustrated a good linearity in the range of 0.1–0.9 MPa, with a resolution of 0.27% F.S. (full scale) at room temperature.
| Original language | English |
|---|---|
| Article number | 1660 |
| Journal | Sensors |
| Volume | 16 |
| Issue number | 10 |
| DOIs | |
| State | Published - 17 Oct 2016 |
Keywords
- Bonding
- Harsh environment
- Pressure sensor
- Silicon carbide
- Ultrasonic assisted machining
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