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Fabrication and study of thin Bi-2223 round wires

  • P. Li*
  • , L. Zhao
  • , T. M. Qu
  • , X. C. Wang
  • , Z. Han
  • *Corresponding author for this work
  • Tsinghua University

Research output: Contribution to journalArticlepeer-review

Abstract

In this paper, experimental works in fabrication of Bi-2223 round wires are presented. Seven filament Bi-2223 round wires ranging from 1.0 mm to 0.3 mm in diameter were fabricated and studied. The critical current density Jc (77 K, self field) of round wires was of 103A/cm2 order. A correlation between Jc and wire diameter was observed. For round Bi-2223 wires, there is an optimal diameter at which Jc reaches peak value and the value of optimal diameter was found to be related to coarseness of precursor powder.

Original languageEnglish
Pages (from-to)837-840
Number of pages4
JournalPhysica C: Superconductivity and its Applications
Volume463-465
Issue numberSUPPL.
DOIs
StatePublished - 1 Oct 2007
Externally publishedYes

Keywords

  • Bi-2223
  • Interface
  • Outgrowth
  • Round wires

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