Experimental tests and numerical simulation studies on nano-indentation of TiN film deposited on N+-implanted aluminum

  • Ming Xu
  • , Liuhe Li
  • , Youming Liu
  • , Xun Cai
  • , Qiulong Chen
  • , Paul K. Chu*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Nitrogen was implanted into aluminum substrate prior to magnetron sputtering of TiN films to introduce a modified layer between the TiN film and Al substrate. In another sample, a Ti interlayer was produced on the untreated substrate by means of magnetron sputtering. From the load-displacement curves obtained by the nano-indentation tests, the ring-like cracks appeared at 38 mN on the TiN/N+-implanted aluminum sample, 25 mN on the TiN/Ti/aluminum sample, and 18 mN on the TiN/untreated aluminum sample. The finite element method (FEM) was used to analyze the stress distribution at the interface of the various samples. The decline in the film base tensile stress and shear stress revealed the advantages of the pre-implanted substrate. All the numerical simulation results are consistent with the increased loading capacity obtained from the load-displacement curves.

Original languageEnglish
Pages (from-to)6707-6711
Number of pages5
JournalSurface and Coatings Technology
Volume201
Issue number15
DOIs
StatePublished - 23 Apr 2007

Keywords

  • FEM
  • Magnetron sputtering
  • Mechanical properties
  • N-implanted aluminum
  • Nano-indentation
  • TiN

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