Experimental study on diffusion bonding of Al-Cu bimetal composite structure

  • Jiao Dong Meng*
  • , Wen Qing Qu
  • , Hong Shou Zhuang
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The experimental study on diffusion bonding of aluminium-copper bimetal composite structure was conducted, and the influence of different welding process, materials combinations, and base metal status on weldability of aluminium alloy and copper was discussed, the joint microstructure was observed. The results show that the solid-state diffusion bonding is suitable for dissimilar materials bonding. The Al-Cu intermetalic compound is formed in the joint zone, so the effective bond can be obtained. The factors such as material combinations, base metal status, and bonding parameters are all influential on diffusion bonding of aluminium alloy and copper. Ni coating on the copper surface can prevent the Al-Cu joint from formation of brittle phases, and because of interaction and inter-diffusion between Al and Ni elements, the joint property is improved.

Original languageEnglish
Pages (from-to)34-37
Number of pages4
JournalJournal of Materials Engineering
Issue number1
StatePublished - Jan 2003

Keywords

  • Diffusion bonding
  • Dissimilar metals
  • Microstructure

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