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ESD Characterisation and Modelling of Digital Integrated Circuits Based on TLP Test

  • Ying Chen
  • , Zhaowen Yan
  • , Changshun Fu
  • , Siyi Xing
  • , Jianhao Ge
  • , Tengfei Gao
  • Beihang University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper investigates the damage characteristics of digital integrated circuits under transmission line pulse (TLP) stress. Accurate damage data were obtained using TLP test. By analyzing the test results, we found that the same type of loops in the same digital integrated circuit have similar I-V characteristic curves and damage current values, while different types of loops have large differences. This indicates that the design of the electrostatic protection inside the chip has a significant effect on the ESD immunity of the loops. In order to more accurately simulate the loop characteristics of digital integrated circuits, this paper adopts a segmented linear modelling approach. The method is able to effectively consider the nonlinear characteristics of the loop, and the data validation proves that the simulation results are highly consistent with the measured data. The model provides a powerful theoretical support and tool for the design optimization, fault analysis and reliability assessment of digital integrated circuits.

Original languageEnglish
Title of host publication2024 IEEE 10th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331533922
DOIs
StatePublished - 2024
Event10th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024 - Guangzhou, China
Duration: 27 Nov 202430 Nov 2024

Publication series

Name2024 IEEE 10th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024

Conference

Conference10th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024
Country/TerritoryChina
CityGuangzhou
Period27/11/2430/11/24

Keywords

  • ESD
  • behavioral model
  • digital integrated circuits
  • electromagnetic compatibility
  • transmission line pulse

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