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Emerging monolithic 3D integration: Opportunities and challenges from the computer system perspective

  • Yuanqing Cheng*
  • , Xiaochen Guo
  • , Vasilis F. Pavlidis
  • *Corresponding author for this work
  • Zhejiang Lab
  • Lehigh University
  • University of Manchester

Research output: Contribution to journalReview articlepeer-review

Abstract

In the past decade, monolithic three dimensional integrated circuits (M3D-ICs) advance fast and demonstrate several important breakthroughs in the fabrication process and circuit level design. This article surveys recent research works on M3D technology from the computer system perspective with several case studies, and presents the opportunities as well as the challenges brought by this emerging technology. We also discuss possible applications of M3D based computer architectures. As the M3D technology is attracting enormous attention from both industry and academia, we expect that this article can be a good reference for the researchers and industrial partners who are interested in this fast evolving field, and promote the research activities of computer system/architecture design with this emerging technology.

Original languageEnglish
Pages (from-to)97-107
Number of pages11
JournalIntegration
Volume85
DOIs
StatePublished - Jul 2022

Keywords

  • Computer architecture
  • Computer system
  • Monolithic 3D IC

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