@inproceedings{e60185d36cd94c9581bdfc6a6996203b,
title = "EMC analysis on field and circuit of PCB",
abstract = "In this paper, electromagnetic compatibility (EMC) of a four-layer printed circuit board (PCB) with the function of Digital-to-Analog conversion (DAC) is analyzed. The characteristic is explored by the method of combination of field and circuit. Resonance of power layer is simulated in SIwave and noise of critical signal lines are simulated in Designer. Based on the result of simulation, some improvement approaches are put forward and applied to the PCB design. Finally, the DAC of the board has accomplished and the frequency spectrum of analog waveform is measured by network analyzer. The result of measurement shows a pure sine spectrum with noise lower than-45dBm.",
keywords = "PCB, electromagnetic compatibility, field and circuit",
author = "Aixin Chen and Li Wang and Xiangwei Ning and Yue Zhao",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 ; Conference date: 14-12-2017 Through 16-12-2017",
year = "2017",
month = jul,
day = "2",
doi = "10.1109/EDAPS.2017.8276943",
language = "英语",
series = "2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--3",
booktitle = "2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017",
address = "美国",
}