Electroless plating process for nickel with high depositing speed and stable electrolyte

The effect of the constituents of the nickel plating solution, i.e. the nickel salt, reducing agent, complexing agent and accelerating agent, on the depositing rate was studied. The technological conditions were determined and a new BH electroless nickel plating process was developed. Adopting this process, the depositing rate can reach 25 μm/h, and the lifetime of the solution can last more than 7 periods. The phosphor content was determined by EDAX method. The result obtained from the X-ray diffraction analyzer shows that the pattern of the deposited layer is a typical noncrystal structure. The performance test shows that the deposited layer has high hardness and good abrasion resistance, its corrosion resistance is better than 1Cr18Ni9Ti stainless steel.