Electrochemical corrosion of Sn-0.75Cu solder joints in NaCl solution

Yan Fang Gao; Cong Qian Cheng; Jie Zhao; Li Hua Wang; Xiao Gang Li

doi:10.1016/S1003-6326(11)61273-9

Electrochemical corrosion of Sn-0.75Cu solder joints in NaCl solution

Yan Fang Gao
, Cong Qian Cheng
, Jie Zhao^*
, Li Hua Wang
, Xiao Gang Li

^*Corresponding author for this work

Dalian University of Technology
University of Science and Technology Beijing

Research output: Contribution to journal › Article › peer-review

45 Scopus citations

Abstract

The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5 NaCl (mass fraction) solution were studied by potentiodynamic polarization test and leaching measurement. The polarization curves indicated that the corrosion rate of Sn-0.75Cu solder was lower than that of Sn-0.75Cu/Cu joint. The morphology observation and phase composition analysis on the corroded product at each interesting potential suggested that Sn ₃O(OH) ₂Cl ₂ formed on the surface of Sn-0.75Cu solder at active dissolution stage. As the potential increased from active/passive transition stage, all the surface of Sn-0.75Cu solder was covered by the Sn ₃O(OH) ₂Cl ₂ and some pits appeared after the polarization test. Compared to the Sn-0.75Cu solder alloy, much more Sn ₃O(OH) ₂Cl ₂ formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn-0.75Cu/Cu solder joints. The leaching test confirmed that the faster electrochemical corrosion rate resulted in the larger amount of Sn released from the Sn-0.75Cu/Cu solder joints.

Original language	English
Pages (from-to)	977-982
Number of pages	6
Journal	Transactions of Nonferrous Metals Society of China (English Edition)
Volume	22
Issue number	4
DOIs	https://doi.org/10.1016/S1003-6326(11)61273-9
State	Published - Apr 2012
Externally published	Yes

Keywords

corroded products
corrosion
leaching behavior
potentiodynamic polarization
Sn-0.75Cu solder
Sn-0.75Cu/Cu joint

Access to Document

10.1016/S1003-6326(11)61273-9

Cite this

@article{695a832674bd4948886e74530fb9ee60,

title = "Electrochemical corrosion of Sn-0.75Cu solder joints in NaCl solution",

abstract = "The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5 NaCl (mass fraction) solution were studied by potentiodynamic polarization test and leaching measurement. The polarization curves indicated that the corrosion rate of Sn-0.75Cu solder was lower than that of Sn-0.75Cu/Cu joint. The morphology observation and phase composition analysis on the corroded product at each interesting potential suggested that Sn 3O(OH) 2Cl 2 formed on the surface of Sn-0.75Cu solder at active dissolution stage. As the potential increased from active/passive transition stage, all the surface of Sn-0.75Cu solder was covered by the Sn 3O(OH) 2Cl 2 and some pits appeared after the polarization test. Compared to the Sn-0.75Cu solder alloy, much more Sn 3O(OH) 2Cl 2 formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn-0.75Cu/Cu solder joints. The leaching test confirmed that the faster electrochemical corrosion rate resulted in the larger amount of Sn released from the Sn-0.75Cu/Cu solder joints.",

keywords = "corroded products, corrosion, leaching behavior, potentiodynamic polarization, Sn-0.75Cu solder, Sn-0.75Cu/Cu joint",

author = "Gao, \{Yan Fang\} and Cheng, \{Cong Qian\} and Jie Zhao and Wang, \{Li Hua\} and Li, \{Xiao Gang\}",

year = "2012",

month = apr,

doi = "10.1016/S1003-6326(11)61273-9",

language = "英语",

volume = "22",

pages = "977--982",

journal = "Transactions of Nonferrous Metals Society of China (English Edition)",

issn = "1003-6326",

publisher = "Nonferrous Metals Society of China",

number = "4",

}

TY - JOUR

T1 - Electrochemical corrosion of Sn-0.75Cu solder joints in NaCl solution

AU - Gao, Yan Fang

AU - Cheng, Cong Qian

AU - Zhao, Jie

AU - Wang, Li Hua

AU - Li, Xiao Gang

PY - 2012/4

Y1 - 2012/4

N2 - The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5 NaCl (mass fraction) solution were studied by potentiodynamic polarization test and leaching measurement. The polarization curves indicated that the corrosion rate of Sn-0.75Cu solder was lower than that of Sn-0.75Cu/Cu joint. The morphology observation and phase composition analysis on the corroded product at each interesting potential suggested that Sn 3O(OH) 2Cl 2 formed on the surface of Sn-0.75Cu solder at active dissolution stage. As the potential increased from active/passive transition stage, all the surface of Sn-0.75Cu solder was covered by the Sn 3O(OH) 2Cl 2 and some pits appeared after the polarization test. Compared to the Sn-0.75Cu solder alloy, much more Sn 3O(OH) 2Cl 2 formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn-0.75Cu/Cu solder joints. The leaching test confirmed that the faster electrochemical corrosion rate resulted in the larger amount of Sn released from the Sn-0.75Cu/Cu solder joints.

AB - The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5 NaCl (mass fraction) solution were studied by potentiodynamic polarization test and leaching measurement. The polarization curves indicated that the corrosion rate of Sn-0.75Cu solder was lower than that of Sn-0.75Cu/Cu joint. The morphology observation and phase composition analysis on the corroded product at each interesting potential suggested that Sn 3O(OH) 2Cl 2 formed on the surface of Sn-0.75Cu solder at active dissolution stage. As the potential increased from active/passive transition stage, all the surface of Sn-0.75Cu solder was covered by the Sn 3O(OH) 2Cl 2 and some pits appeared after the polarization test. Compared to the Sn-0.75Cu solder alloy, much more Sn 3O(OH) 2Cl 2 formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn-0.75Cu/Cu solder joints. The leaching test confirmed that the faster electrochemical corrosion rate resulted in the larger amount of Sn released from the Sn-0.75Cu/Cu solder joints.

KW - corroded products

KW - corrosion

KW - leaching behavior

KW - potentiodynamic polarization

KW - Sn-0.75Cu solder

KW - Sn-0.75Cu/Cu joint

UR - https://www.scopus.com/pages/publications/84861049802

U2 - 10.1016/S1003-6326(11)61273-9

DO - 10.1016/S1003-6326(11)61273-9

M3 - 文章

AN - SCOPUS:84861049802

SN - 1003-6326

VL - 22

SP - 977

EP - 982

JO - Transactions of Nonferrous Metals Society of China (English Edition)

JF - Transactions of Nonferrous Metals Society of China (English Edition)

IS - 4

ER -

Electrochemical corrosion of Sn-0.75Cu solder joints in NaCl solution

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this