Skip to main navigation Skip to search Skip to main content

Effects of temperature on surface modification of W exposed to He particles

  • C. Li
  • , H. Greuner
  • , Y. Yuan
  • , G. N. Luo
  • , B. Böswirth
  • , B. Q. Fu
  • , H. Y. Xu
  • , Y. Z. Jia
  • , W. Liu*
  • *Corresponding author for this work
  • Tsinghua University
  • Max Planck Institute for Plasma Physics
  • CAS - Institute of Plasma Physics

Research output: Contribution to journalArticlepeer-review

Abstract

The effect of combined heating and helium particle flux on annealed tungsten samples has been studied in the neutral beam facility GLADIS. He beams with power densities of 2.4 MW/m2 and 9.5 MW/m2 were used to adiabatically load the samples to peak surface temperatures from ∼950 °C (1223 K) to ∼2700 °C (2973 K). Changes in the surface morphology resulting from combined heat and the flux exposure were studied for He fluences up to 3 × 1022/m2. Typical structures for the sample loaded at ∼950 °C (1223 K) were blisters with a clear grain orientation dependence and the largest blisters formed on grains with 〈0 0 1〉 surface normal. However at higher temperatures, blistering was more easily suppressed for grains near this orientation because the growth of larger blister takes place more slowly. An evolution from a "porous structure" to a "coral-like structure" with increasing fluence was observed on the samples loaded at the highest temperature. Based on these results mechanisms for surface modification at different temperatures are discussed and a texture with 〈0 0 1〉 parallel to the normal direction of the grains is suggested to optimize the plasma facing material due to their stronger resistance to early stage blistering.

Original languageEnglish
Pages (from-to)201-206
Number of pages6
JournalJournal of Nuclear Materials
Volume455
Issue number1-3
DOIs
StatePublished - Dec 2014

Fingerprint

Dive into the research topics of 'Effects of temperature on surface modification of W exposed to He particles'. Together they form a unique fingerprint.

Cite this