Effects of microstructure on tensile strength of electroformed copper

The electroformed copper with various microstructures are fabricated under conditions of non-agitation and ultrasonic agitation according to the demand of the electroforming micro components. The microstructure of the electroformed copper layer was observed by optical microscope (OM), scanning electron microscope (SEM) and transmission electron microscope (TEM). The preferred orientations of the layer were characterized by X-ray diffraction (XRD). The tensile strength was evaluated with a tensile tester. It was found that the copper layer preferentially grow along the (220) plane during the electroforming process, and the ultrasound-assisted technique led to a highly preferred orientation. The effects of ultrasonic vibration increased the chance of nucleation and controlled the excessive growth of copper grains during electroforming process. The microstructure of copper electroformed under condition of ultrasonic agitation is made up of regular columnar crystals, and its tensile strength increased by 40% in comparison with that of under condition of stationary state.