Abstract
SiC films were deposited by HFCVD using CH4, SiH4, and H2 gases. It was evidenced that the oxygen contamination in the films is reduced by adding a little CF4 in the deposition process.
| Original language | English |
|---|---|
| Pages (from-to) | 1993-1995 |
| Number of pages | 3 |
| Journal | Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films |
| Volume | 21 |
| Issue number | 6 |
| DOIs | |
| State | Published - Nov 2003 |
| Externally published | Yes |
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