Effect of load variation on the performance of pump-driven chip-level two-phase cooling system

As a critical component of information infrastructure, data centers' thermal management system efficiency directly impacts equipment operational stability and energy utilization efficiency. This paper innovatively proposes a pump-driven two-phase cooling system oriented toward chip-level thermal control and conducts in-depth experimental research on the influence of dynamic thermal loads on the thermal response characteristics of the cooling system. The experimental results indicate that the cooling system can swiftly achieve a stable transition within 4–5 s during load fluctuations. The study reveals that the heat conduction within the chip and the thermal conduction of the TIM account for 71.6 % of the chip's heat transfer thermal resistance. Under extreme test conditions, the maximum temperature difference between chip cores can reach 16 °C. In addition, by increasing the operating temperature of the cooling system, the heat transfer temperature difference of the cooling system can be reduced. The experiments also find that starting and operating the system by loading servers one by one from the bottom of the cabinet upwards is the recommended approach for this system. The safe operating range of the system is determined to be when the outlet quality is below 0.77. Within this range, the cooling system can stably support the start-stop operations of servers as well as dynamic load switching, thereby ensuring the efficient and stable operation of the data center.