Effect of interaction between P and Ce on properties of copper

Jin Tao Song; Yu Duo Fu; Ke Xing Song; Qian Qian Zhu; Xiao Wen Peng; Yun Xiao Hua; Yan Jun Zhou; Xiu Hua Guo; Shi Zhong An; Ying Xuan Ma

doi:10.1080/02670836.2023.2230004

Effect of interaction between P and Ce on properties of copper

Jin Tao Song
, Yu Duo Fu
, Ke Xing Song^*
, Qian Qian Zhu
, Xiao Wen Peng
, Yun Xiao Hua
, Yan Jun Zhou
, Xiu Hua Guo
, Shi Zhong An
, Ying Xuan Ma

^*Corresponding author for this work

Henan University of Science and Technology
Henan Key Laboratory of Nonferrous Materials Science and Processing Technology
Collaborative Innovation Center of Nonferrous Metals
Henan Academy of Sciences

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

The effect of interaction between Ce and P on the microstructure and properties of copper has been rarely reported. In this study, it was investigated by utilising the OM, EPMA, SEM and TEM techniques, combined with conductivity and tensile tests. The results indicated that the grain size and conductivity of as-cast copper could be significantly influenced by the interaction. More importantly, the plasticity of as-cast copper did not seriously damage by the interaction, and the elongation of as-cast 3# (Cu-0.016P-0.075Ce) was still up to 39.3%. This is due to a strong binding force of the coherent interface between CeP and copper.

Original language	English
Pages (from-to)	2966-2975
Number of pages	10
Journal	Materials Science and Technology (United Kingdom)
Volume	39
Issue number	18
DOIs	https://doi.org/10.1080/02670836.2023.2230004
State	Published - 2023
Externally published	Yes

Keywords

coherent interface
conductivity
disregistry
interaction between P and Ce
Pure copper
tensile properties

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10.1080/02670836.2023.2230004

Cite this

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title = "Effect of interaction between P and Ce on properties of copper",

abstract = "The effect of interaction between Ce and P on the microstructure and properties of copper has been rarely reported. In this study, it was investigated by utilising the OM, EPMA, SEM and TEM techniques, combined with conductivity and tensile tests. The results indicated that the grain size and conductivity of as-cast copper could be significantly influenced by the interaction. More importantly, the plasticity of as-cast copper did not seriously damage by the interaction, and the elongation of as-cast 3\# (Cu-0.016P-0.075Ce) was still up to 39.3\%. This is due to a strong binding force of the coherent interface between CeP and copper.",

keywords = "coherent interface, conductivity, disregistry, interaction between P and Ce, Pure copper, tensile properties",

author = "Song, \{Jin Tao\} and Fu, \{Yu Duo\} and Song, \{Ke Xing\} and Zhu, \{Qian Qian\} and Peng, \{Xiao Wen\} and Hua, \{Yun Xiao\} and Zhou, \{Yan Jun\} and Guo, \{Xiu Hua\} and An, \{Shi Zhong\} and Ma, \{Ying Xuan\}",

note = "Publisher Copyright: {\textcopyright} 2023 Institute of Materials, Minerals and Mining.",

year = "2023",

doi = "10.1080/02670836.2023.2230004",

language = "英语",

volume = "39",

pages = "2966--2975",

journal = "Materials Science and Technology (United Kingdom)",

issn = "0267-0836",

publisher = "SAGE Publications Inc.",

number = "18",

}

TY - JOUR

T1 - Effect of interaction between P and Ce on properties of copper

AU - Song, Jin Tao

AU - Fu, Yu Duo

AU - Song, Ke Xing

AU - Zhu, Qian Qian

AU - Peng, Xiao Wen

AU - Hua, Yun Xiao

AU - Zhou, Yan Jun

AU - Guo, Xiu Hua

AU - An, Shi Zhong

AU - Ma, Ying Xuan

PY - 2023

Y1 - 2023

N2 - The effect of interaction between Ce and P on the microstructure and properties of copper has been rarely reported. In this study, it was investigated by utilising the OM, EPMA, SEM and TEM techniques, combined with conductivity and tensile tests. The results indicated that the grain size and conductivity of as-cast copper could be significantly influenced by the interaction. More importantly, the plasticity of as-cast copper did not seriously damage by the interaction, and the elongation of as-cast 3# (Cu-0.016P-0.075Ce) was still up to 39.3%. This is due to a strong binding force of the coherent interface between CeP and copper.

AB - The effect of interaction between Ce and P on the microstructure and properties of copper has been rarely reported. In this study, it was investigated by utilising the OM, EPMA, SEM and TEM techniques, combined with conductivity and tensile tests. The results indicated that the grain size and conductivity of as-cast copper could be significantly influenced by the interaction. More importantly, the plasticity of as-cast copper did not seriously damage by the interaction, and the elongation of as-cast 3# (Cu-0.016P-0.075Ce) was still up to 39.3%. This is due to a strong binding force of the coherent interface between CeP and copper.

KW - coherent interface

KW - conductivity

KW - disregistry

KW - interaction between P and Ce

KW - Pure copper

KW - tensile properties

UR - https://www.scopus.com/pages/publications/85164170797

U2 - 10.1080/02670836.2023.2230004

DO - 10.1080/02670836.2023.2230004

M3 - 文章

AN - SCOPUS:85164170797

SN - 0267-0836

VL - 39

SP - 2966

EP - 2975

JO - Materials Science and Technology (United Kingdom)

JF - Materials Science and Technology (United Kingdom)

IS - 18

ER -

Effect of interaction between P and Ce on properties of copper

Abstract

Keywords

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