Dynamic simulation of solid-state diffusion bonding

G. Q. Wu; Z. F. Li; G. X. Luo; H. Y. Li; Z. Huang

doi:10.1016/j.msea.2006.10.115

Dynamic simulation of solid-state diffusion bonding

G. Q. Wu^*
, Z. F. Li
, G. X. Luo
, H. Y. Li
, Z. Huang

^*Corresponding author for this work

School of Materials Science and Engineering

Beihang University

Research output: Contribution to journal › Article › peer-review

36 Scopus citations

Abstract

By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The effects of different operating mechanisms, bonding parameters and microstructures on bonding were investigated. The simulation results indicate that, it is vital to consider the real information of the intended bonding surfaces and the effect of diffusion distance in a definite time; the metastable microstructure and the stable ultrafine microstructure exhibit better bonding characteristic than that of the original stable microstructure, which is in agreement with experimental results.

Original language	English
Pages (from-to)	529-535
Number of pages	7
Journal	Materials Science and Engineering: A
Volume	452-453
DOIs	https://doi.org/10.1016/j.msea.2006.10.115
State	Published - 15 Apr 2007

Keywords

Diffusion
Diffusion bonding
Microstructure
Modeling
Surface

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10.1016/j.msea.2006.10.115

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@article{229b0b566a7543059f987488da3ea33e,

title = "Dynamic simulation of solid-state diffusion bonding",

abstract = "By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The effects of different operating mechanisms, bonding parameters and microstructures on bonding were investigated. The simulation results indicate that, it is vital to consider the real information of the intended bonding surfaces and the effect of diffusion distance in a definite time; the metastable microstructure and the stable ultrafine microstructure exhibit better bonding characteristic than that of the original stable microstructure, which is in agreement with experimental results.",

keywords = "Diffusion, Diffusion bonding, Microstructure, Modeling, Surface",

author = "Wu, \{G. Q.\} and Li, \{Z. F.\} and Luo, \{G. X.\} and Li, \{H. Y.\} and Z. Huang",

year = "2007",

month = apr,

day = "15",

doi = "10.1016/j.msea.2006.10.115",

language = "英语",

volume = "452-453",

pages = "529--535",

journal = "Materials Science and Engineering: A",

issn = "0921-5093",

publisher = "Elsevier Ltd",

}

TY - JOUR

T1 - Dynamic simulation of solid-state diffusion bonding

AU - Wu, G. Q.

AU - Li, Z. F.

AU - Luo, G. X.

AU - Li, H. Y.

AU - Huang, Z.

PY - 2007/4/15

Y1 - 2007/4/15

N2 - By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The effects of different operating mechanisms, bonding parameters and microstructures on bonding were investigated. The simulation results indicate that, it is vital to consider the real information of the intended bonding surfaces and the effect of diffusion distance in a definite time; the metastable microstructure and the stable ultrafine microstructure exhibit better bonding characteristic than that of the original stable microstructure, which is in agreement with experimental results.

AB - By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The effects of different operating mechanisms, bonding parameters and microstructures on bonding were investigated. The simulation results indicate that, it is vital to consider the real information of the intended bonding surfaces and the effect of diffusion distance in a definite time; the metastable microstructure and the stable ultrafine microstructure exhibit better bonding characteristic than that of the original stable microstructure, which is in agreement with experimental results.

KW - Diffusion

KW - Diffusion bonding

KW - Microstructure

KW - Modeling

KW - Surface

UR - https://www.scopus.com/pages/publications/33847248925

U2 - 10.1016/j.msea.2006.10.115

DO - 10.1016/j.msea.2006.10.115

M3 - 文章

AN - SCOPUS:33847248925

SN - 0921-5093

VL - 452-453

SP - 529

EP - 535

JO - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

ER -

Dynamic simulation of solid-state diffusion bonding

Abstract

Keywords

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