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Dynamic crack propagation in copper bicrystals grain boundary by atomistic simulation

  • Yanguang Zhou
  • , Zhenyu Yang*
  • , Zixing Lu
  • *Corresponding author for this work
  • Beihang University

Research output: Contribution to journalArticlepeer-review

Abstract

Grain boundaries (GBs) dependent crack propagation has been observed in previous experiments, which shows strong anisotropy of cracks propagation behaviors in nanocrystalline. In this paper, the propagation behaviors of central cracks at different symmetrical tilt GBs in bicrystalline copper are studied by using atomistic simulations. Three different modes of interfacial crack propagation are found: crack prefers to propagate in a brittle manner along GB; crack propagates with voids and coalescence ahead of the crack tip, and blunts in the opposite direction; crack blunts at both two tips of the crack. Furthermore, thermo effects on the crack propagation are also investigated in our simulations. It is found that the mode of crack propagation at a certain GB changes from brittle to ductile at a critical temperature, which is different for the GB with different crystalline structures.

Original languageEnglish
Pages (from-to)116-124
Number of pages9
JournalMaterials Science and Engineering: A
Volume599
DOIs
StatePublished - 2 Apr 2014

Keywords

  • Brittle to ductile
  • Dynamic crack propagation
  • Grain boundary
  • Molecular dynamics
  • Thermo effects

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