@inproceedings{d7c835b9685644939ae78a4d918bb9ae,
title = "Direct Simulation Analysis of Electromechanical Coupling and Joule Heating Effect of a MEMS SiC Piezoresistive Accelerometer",
abstract = "MEMS accelerometers have been used in various fields of life, and the design methods for MEMS accelerometers are mature nowadays. But in the design of piezoresistive accelerometers, the general method of structural mechanics simulation combined with circuit theoretical models inevitably involves parameter assumptions and simplification of electrical models, which will introduce calculation error. Therefore, in this paper, a direct numerical simulation method using COMSOL is carried out for a SiC MEMS piezoresistive accelerometer. The electromechanical coupling simulation of the sensor is realized by combining the structural mechanics simulation with the current domain simulation. At the same time, the circuit thermal effect is introduced into the simulation process to realize the coupled calculation of the temperature field. This simulation method can effectively avoid the errors caused by the theoretical model, and at the same time provide technical support for the development of the machine-electric-thermal field system coupled simulation.",
keywords = "MEMS, Simulation, accelerometer, electromechanical, piezoresistive",
author = "Yanxin Zhai and Tiantong Xu and Guoqiang Xu and Xiaoda Cao and Chunhui Yang and Haiwang Li",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 9th International Forum on Electrical Engineering and Automation, IFEEA 2022 ; Conference date: 04-11-2022 Through 06-11-2022",
year = "2022",
doi = "10.1109/IFEEA57288.2022.10037835",
language = "英语",
series = "2022 9th International Forum on Electrical Engineering and Automation, IFEEA 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "969--974",
booktitle = "2022 9th International Forum on Electrical Engineering and Automation, IFEEA 2022",
address = "美国",
}