Abstract
The introduction of paper and origami into industry and daily life has been a hallmark of human civilization. However, origami's performance is limited by the properties of the constituent materials, including long-term bending, electrical, and thermal conductivity. Here, we report a new method for directly adhering liquid metal onto non-wetting substrates on a large scale, allowing for the regulation of the mechanical and electrical properties of the enhanced paper by controlling the applied force during fabrication. The mechanism of adhesion between different liquid metals (eGaIn and BiInSn) and non-wetting substrates through force is explained. Furthermore, multifunctional origami structures based on the enhanced paper can switch between several deformation modes and include a shape memory antenna for receiving and transmitting electromagnetic signals. This work offers a generalized approach to developing multifunctional paper for applications in wearable testing platforms, flexible devices, and soft robotics.
| Original language | English |
|---|---|
| Article number | 101419 |
| Journal | Cell Reports Physical Science |
| Volume | 4 |
| Issue number | 6 |
| DOIs | |
| State | Published - 21 Jun 2023 |
Keywords
- force-responsible adhesion
- liquid metal
- mechanical reconfigurable devices
- origami structure
- origami structures
- smart materials
- variable stiffness
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