TY - GEN
T1 - Digital Simulation Method for Electromagnetic-Thermal-Mechanical Environment of Aerospace Products
AU - Zhang, Yan
AU - Wu, Hongduo
AU - Wang, Penghui
AU - Zhou, Dong
AU - Ge, Guangya
AU - Kang, Zixu
AU - Guo, Ziyue
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Addressing the deficiencies in the typical digital simulation methods for aerospace products in terms of lacking a comprehensive multi-physics coupling framework and incomplete consideration of physical fields and relevant simulation elements, a digital simulation method is proposed for the electromagnetic-thermal-mechanical typical environmental conditions of aerospace products. Firstly, an analysis of the multi-physics field, computational elements, and coupling relationships of aerospace products is conducted to clarify the simulation elements. Secondly, the digital simulation process of the electromagnetic-thermal-mechanical coupling environment is outlined, and a method for digital modeling of multi-physics fields is presented based on sequential coupling. Finally, the proposed method is applied to a printed circuit board used in a certain aerospace product to validate the feasibility and effectiveness of the framework proposed in this study, providing reference for the testing, identification, and improvement of aerospace products.
AB - Addressing the deficiencies in the typical digital simulation methods for aerospace products in terms of lacking a comprehensive multi-physics coupling framework and incomplete consideration of physical fields and relevant simulation elements, a digital simulation method is proposed for the electromagnetic-thermal-mechanical typical environmental conditions of aerospace products. Firstly, an analysis of the multi-physics field, computational elements, and coupling relationships of aerospace products is conducted to clarify the simulation elements. Secondly, the digital simulation process of the electromagnetic-thermal-mechanical coupling environment is outlined, and a method for digital modeling of multi-physics fields is presented based on sequential coupling. Finally, the proposed method is applied to a printed circuit board used in a certain aerospace product to validate the feasibility and effectiveness of the framework proposed in this study, providing reference for the testing, identification, and improvement of aerospace products.
KW - Aerospace Products
KW - Digital Simulation Method
KW - Multi-physics Field Coupling
UR - https://www.scopus.com/pages/publications/105030320127
U2 - 10.1109/ICRMS63553.2024.00157
DO - 10.1109/ICRMS63553.2024.00157
M3 - 会议稿件
AN - SCOPUS:105030320127
T3 - Proceedings - 2024 15th International Conference on Reliability, Maintenance and Safety, ICRMS 2024
SP - 983
EP - 990
BT - Proceedings - 2024 15th International Conference on Reliability, Maintenance and Safety, ICRMS 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 15th International Conference on Reliability, Maintenance and Safety, ICRMS 2024
Y2 - 31 July 2024 through 2 August 2024
ER -