Diffusion bonded transition joint of TC4 to QA110-3-1.5

Solid-state diffusion bonding has been done to produce transition joint between TC4 and QAl10-3-1.5 at the temperature 850°C for 60 min. The produced diffusion bonded couples were evaluated by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). SEM revealed the presences of the different reaction regions in the diffusion zone and 'kirkendall voids' were observed in the interface. This study indicated the existences of Cu₃Ti, Cu and Ti phases in the diffusion zone of the joint confirmed by XRD. The microhardness tests revealed that the microhardness of TC4 jointing affected zone (JAZ) is higher than the TC4 base materials, and transition zone close to TC4 possesses the highest microhardness value.