Design, manufacturing and recycling in product lifecycle: New challenges and trends

Longfei Zhou; Shengsheng Cao; Jiaxin Liu; Tian Tan; Fuxin Du; Yajun Fang; Lin Zhang

doi:10.1109/UV.2018.8709326

Design, manufacturing and recycling in product lifecycle: New challenges and trends

Longfei Zhou
, Shengsheng Cao
, Jiaxin Liu
, Tian Tan
, Fuxin Du^*
, Yajun Fang
, Lin Zhang

^*Corresponding author for this work

School of Automation Science and Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

Development of new technologies such as Internet of Things, Cloud-based Platform and Artificial Intelligence has brought new challenges and opportunities to the whole product lifecycle. Design, manufacturing and recycling are the most important stages in the product lifecycle. This paper analyzes new challenges and development trends of product lifecycle in terms of individualized design, intelligent manufacturing and new recycling. The effects of new technologies on product lifecycle management and optimization are also discussed. In product design, we discussed the relationship between requirements, design and products. In manufacturing, we analyzed challenges in manufacturing processes and new trends such as cloud manufacturing and intelligent manufacturing. In recycling, we reviewed the problems in recycling and discussed the new methods.

Original language	English
Title of host publication	4th IEEE International Conference on Universal Village 2018, UV 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781538651971
DOIs	https://doi.org/10.1109/UV.2018.8709326
State	Published - 2 Jul 2018
Event	4th IEEE International Conference on Universal Village, UV 2018 - Boston, United States Duration: 21 Oct 2018 → 24 Oct 2018

Publication series

Name	4th IEEE International Conference on Universal Village 2018, UV 2018
Volume	2019-January

Conference

Conference	4th IEEE International Conference on Universal Village, UV 2018
Country/Territory	United States
City	Boston
Period	21/10/18 → 24/10/18

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy
SDG 11 Sustainable Cities and Communities

Keywords

design
manufacturing
product lifecycle
recycling
review
trend

Access to Document

10.1109/UV.2018.8709326

Cite this

Zhou, L., Cao, S., Liu, J., Tan, T., Du, F., Fang, Y., & Zhang, L. (2018). Design, manufacturing and recycling in product lifecycle: New challenges and trends. In 4th IEEE International Conference on Universal Village 2018, UV 2018 Article 8709326 (4th IEEE International Conference on Universal Village 2018, UV 2018; Vol. 2019-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/UV.2018.8709326

@inproceedings{de7faf367c78498892d04106f34bdff0,

title = "Design, manufacturing and recycling in product lifecycle: New challenges and trends",

abstract = "Development of new technologies such as Internet of Things, Cloud-based Platform and Artificial Intelligence has brought new challenges and opportunities to the whole product lifecycle. Design, manufacturing and recycling are the most important stages in the product lifecycle. This paper analyzes new challenges and development trends of product lifecycle in terms of individualized design, intelligent manufacturing and new recycling. The effects of new technologies on product lifecycle management and optimization are also discussed. In product design, we discussed the relationship between requirements, design and products. In manufacturing, we analyzed challenges in manufacturing processes and new trends such as cloud manufacturing and intelligent manufacturing. In recycling, we reviewed the problems in recycling and discussed the new methods.",

keywords = "design, manufacturing, product lifecycle, recycling, review, trend",

author = "Longfei Zhou and Shengsheng Cao and Jiaxin Liu and Tian Tan and Fuxin Du and Yajun Fang and Lin Zhang",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 4th IEEE International Conference on Universal Village, UV 2018 ; Conference date: 21-10-2018 Through 24-10-2018",

year = "2018",

month = jul,

day = "2",

doi = "10.1109/UV.2018.8709326",

language = "英语",

series = "4th IEEE International Conference on Universal Village 2018, UV 2018",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "4th IEEE International Conference on Universal Village 2018, UV 2018",

address = "美国",

}

Zhou, L, Cao, S, Liu, J, Tan, T, Du, F, Fang, Y & Zhang, L 2018, Design, manufacturing and recycling in product lifecycle: New challenges and trends. in 4th IEEE International Conference on Universal Village 2018, UV 2018., 8709326, 4th IEEE International Conference on Universal Village 2018, UV 2018, vol. 2019-January, Institute of Electrical and Electronics Engineers Inc., 4th IEEE International Conference on Universal Village, UV 2018, Boston, United States, 21/10/18. https://doi.org/10.1109/UV.2018.8709326

Design, manufacturing and recycling in product lifecycle: New challenges and trends. / Zhou, Longfei; Cao, Shengsheng; Liu, Jiaxin et al.
4th IEEE International Conference on Universal Village 2018, UV 2018. Institute of Electrical and Electronics Engineers Inc., 2018. 8709326 (4th IEEE International Conference on Universal Village 2018, UV 2018; Vol. 2019-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

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T2 - 4th IEEE International Conference on Universal Village, UV 2018

AU - Zhou, Longfei

AU - Cao, Shengsheng

AU - Liu, Jiaxin

AU - Tan, Tian

AU - Du, Fuxin

AU - Fang, Yajun

AU - Zhang, Lin

PY - 2018/7/2

Y1 - 2018/7/2

N2 - Development of new technologies such as Internet of Things, Cloud-based Platform and Artificial Intelligence has brought new challenges and opportunities to the whole product lifecycle. Design, manufacturing and recycling are the most important stages in the product lifecycle. This paper analyzes new challenges and development trends of product lifecycle in terms of individualized design, intelligent manufacturing and new recycling. The effects of new technologies on product lifecycle management and optimization are also discussed. In product design, we discussed the relationship between requirements, design and products. In manufacturing, we analyzed challenges in manufacturing processes and new trends such as cloud manufacturing and intelligent manufacturing. In recycling, we reviewed the problems in recycling and discussed the new methods.

AB - Development of new technologies such as Internet of Things, Cloud-based Platform and Artificial Intelligence has brought new challenges and opportunities to the whole product lifecycle. Design, manufacturing and recycling are the most important stages in the product lifecycle. This paper analyzes new challenges and development trends of product lifecycle in terms of individualized design, intelligent manufacturing and new recycling. The effects of new technologies on product lifecycle management and optimization are also discussed. In product design, we discussed the relationship between requirements, design and products. In manufacturing, we analyzed challenges in manufacturing processes and new trends such as cloud manufacturing and intelligent manufacturing. In recycling, we reviewed the problems in recycling and discussed the new methods.

KW - design

KW - manufacturing

KW - product lifecycle

KW - recycling

KW - review

KW - trend

UR - https://www.scopus.com/pages/publications/85065868332

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DO - 10.1109/UV.2018.8709326

M3 - 会议稿件

AN - SCOPUS:85065868332

T3 - 4th IEEE International Conference on Universal Village 2018, UV 2018

BT - 4th IEEE International Conference on Universal Village 2018, UV 2018

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 21 October 2018 through 24 October 2018

ER -

Zhou L, Cao S, Liu J, Tan T, Du F, Fang Y et al. Design, manufacturing and recycling in product lifecycle: New challenges and trends. In 4th IEEE International Conference on Universal Village 2018, UV 2018. Institute of Electrical and Electronics Engineers Inc. 2018. 8709326. (4th IEEE International Conference on Universal Village 2018, UV 2018). doi: 10.1109/UV.2018.8709326

Design, manufacturing and recycling in product lifecycle: New challenges and trends

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

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