TY - GEN
T1 - Design and Optimization of Microchannel in a Fan-out Package for Heat Dissipation
AU - Sun, Bo
AU - Zhang, Weize
AU - Guo, Chunbing
AU - Cui, Chengqiang
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - With the increasing power density of integrated circuit packages, the thermal management issue has become one of the most critical issues, and the microchannels is one of the potential methods for heat dissipation. In this paper, four types of Y-shaped microchannels are designed for fan-out packages. The FEM simulations have been conducted to calculate the temperature distribution and pressure drop by changing the angle of microfluidic channels and water flow velocity. Thus, the heat dissipation effect of microfluidic channels with different structures of the same volume can be investigated. Due to the nonlinear properties of microchannels, it is difficult to achieve the minimum temperature, pressure drop and temperature uniformity at the same time. For the application of microchannels in practical fan-out packages, design trade-offs and comprehensive analysis are necessary.
AB - With the increasing power density of integrated circuit packages, the thermal management issue has become one of the most critical issues, and the microchannels is one of the potential methods for heat dissipation. In this paper, four types of Y-shaped microchannels are designed for fan-out packages. The FEM simulations have been conducted to calculate the temperature distribution and pressure drop by changing the angle of microfluidic channels and water flow velocity. Thus, the heat dissipation effect of microfluidic channels with different structures of the same volume can be investigated. Due to the nonlinear properties of microchannels, it is difficult to achieve the minimum temperature, pressure drop and temperature uniformity at the same time. For the application of microchannels in practical fan-out packages, design trade-offs and comprehensive analysis are necessary.
UR - https://www.scopus.com/pages/publications/85147450854
U2 - 10.1109/EPTC56328.2022.10013216
DO - 10.1109/EPTC56328.2022.10013216
M3 - 会议稿件
AN - SCOPUS:85147450854
T3 - Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022
SP - 885
EP - 889
BT - Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th Electronics Packaging Technology Conference, EPTC 2022
Y2 - 7 December 2022 through 9 December 2022
ER -