TY - GEN
T1 - Demonstration of 128 Kb SOT-MRAM chip with 5 ns write and 15 ns read speed, high endurance over 1010and low ECC-on bit error rate
AU - Jiang, Chuanpeng
AU - Lu, Shiyang
AU - Zhang, Zhongkui
AU - Fan, Xiaofei
AU - Xiong, Danrong
AU - Li, Jinhao
AU - Liu, Hongxi
AU - Wang, Gefei
AU - Zhang, He
AU - Jin, Hui
AU - Cao, Kaihua
AU - Zhang, Deming
AU - Wang, Zhaohao
AU - Zhao, Weisheng
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Three-terminal spin-orbit torque (SOT) MRAM attracts great interests in industry but faces integration challenges. In this paper, we succeed in demonstration of the 128 Kb SOT-MRAM chip. Thanks to the process improvement to remove the redeposition, the in-die function yield of the 128 Kb chip is greater than 99.9%. Besides, through reducing the size and optimizing the films, we are able to reduce the critical switching current (Ic) by 25%. The fabricated 128 Kb chip can achieve 5 ns write speed in an industrial-level temperature ranging from -40 °C to 125 °C. The read speed can reach 15 ns. In addition to superior write/read performance, the endurance over 1010 cycles and high data retention over 10 years at the operating temperature are demonstrated. Moreover, we propose a multi-pulse write method to solve the intermediate state issue of the magnetic tunnel junction (MTJ). Finally, recurring to the Hamming error checking and correcting (ECC) based on FPGA, we succeed in a 0-bit-error-rate 128 Kb chip. Our effort will help to expedite the SOT-MRAM to go to the market.
AB - Three-terminal spin-orbit torque (SOT) MRAM attracts great interests in industry but faces integration challenges. In this paper, we succeed in demonstration of the 128 Kb SOT-MRAM chip. Thanks to the process improvement to remove the redeposition, the in-die function yield of the 128 Kb chip is greater than 99.9%. Besides, through reducing the size and optimizing the films, we are able to reduce the critical switching current (Ic) by 25%. The fabricated 128 Kb chip can achieve 5 ns write speed in an industrial-level temperature ranging from -40 °C to 125 °C. The read speed can reach 15 ns. In addition to superior write/read performance, the endurance over 1010 cycles and high data retention over 10 years at the operating temperature are demonstrated. Moreover, we propose a multi-pulse write method to solve the intermediate state issue of the magnetic tunnel junction (MTJ). Finally, recurring to the Hamming error checking and correcting (ECC) based on FPGA, we succeed in a 0-bit-error-rate 128 Kb chip. Our effort will help to expedite the SOT-MRAM to go to the market.
UR - https://www.scopus.com/pages/publications/86000004845
U2 - 10.1109/IEDM50854.2024.10873510
DO - 10.1109/IEDM50854.2024.10873510
M3 - 会议稿件
AN - SCOPUS:86000004845
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2024 IEEE International Electron Devices Meeting, IEDM 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Electron Devices Meeting, IEDM 2024
Y2 - 7 December 2024 through 11 December 2024
ER -