Delamination and electromigration of film lines on polymer substrate under electrical loading

Qing Hua Wang; Hui Min Xie; Xue Feng; Zejing Chen; Fu Long Dai

doi:10.1109/LED.2008.2008401

Delamination and electromigration of film lines on polymer substrate under electrical loading

Qing Hua Wang^*
, Hui Min Xie
, Xue Feng
, Zejing Chen
, Fu Long Dai

^*Corresponding author for this work

Tsinghua University

Research output: Contribution to journal › Article › peer-review

19 Scopus citations

Abstract

As the main influencing factors for instability of film lines are widely used in microelectromechanical systems, buckle-driven delamination and electromigration of film lines on polymer substrate under electrical loading are reported in this letter. The critical buckling condition is obtained through Euler formula. In addition, postbuckling analysis for the film is derived to calculate the residual stress distribution. Both electromigration and buckling stress control the film fracture. Film buckling depends not only on the thermal mismatch between the film line and the substrate but also on the applied electrical loading.

Original language	English
Pages (from-to)	11-13
Number of pages	3
Journal	IEEE Electron Device Letters
Volume	30
Issue number	1
DOIs	https://doi.org/10.1109/LED.2008.2008401
State	Published - 2009
Externally published	Yes

Keywords

Buckle-driven delamination
Electrical loading
Electromigration
Film
Fracture

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10.1109/LED.2008.2008401

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title = "Delamination and electromigration of film lines on polymer substrate under electrical loading",

abstract = "As the main influencing factors for instability of film lines are widely used in microelectromechanical systems, buckle-driven delamination and electromigration of film lines on polymer substrate under electrical loading are reported in this letter. The critical buckling condition is obtained through Euler formula. In addition, postbuckling analysis for the film is derived to calculate the residual stress distribution. Both electromigration and buckling stress control the film fracture. Film buckling depends not only on the thermal mismatch between the film line and the substrate but also on the applied electrical loading.",

keywords = "Buckle-driven delamination, Electrical loading, Electromigration, Film, Fracture",

author = "Wang, \{Qing Hua\} and Xie, \{Hui Min\} and Xue Feng and Zejing Chen and Dai, \{Fu Long\}",

year = "2009",

doi = "10.1109/LED.2008.2008401",

language = "英语",

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T1 - Delamination and electromigration of film lines on polymer substrate under electrical loading

AU - Wang, Qing Hua

AU - Xie, Hui Min

AU - Feng, Xue

AU - Chen, Zejing

AU - Dai, Fu Long

PY - 2009

Y1 - 2009

N2 - As the main influencing factors for instability of film lines are widely used in microelectromechanical systems, buckle-driven delamination and electromigration of film lines on polymer substrate under electrical loading are reported in this letter. The critical buckling condition is obtained through Euler formula. In addition, postbuckling analysis for the film is derived to calculate the residual stress distribution. Both electromigration and buckling stress control the film fracture. Film buckling depends not only on the thermal mismatch between the film line and the substrate but also on the applied electrical loading.

AB - As the main influencing factors for instability of film lines are widely used in microelectromechanical systems, buckle-driven delamination and electromigration of film lines on polymer substrate under electrical loading are reported in this letter. The critical buckling condition is obtained through Euler formula. In addition, postbuckling analysis for the film is derived to calculate the residual stress distribution. Both electromigration and buckling stress control the film fracture. Film buckling depends not only on the thermal mismatch between the film line and the substrate but also on the applied electrical loading.

KW - Buckle-driven delamination

KW - Electrical loading

KW - Electromigration

KW - Film

KW - Fracture

UR - https://www.scopus.com/pages/publications/58149492934

U2 - 10.1109/LED.2008.2008401

DO - 10.1109/LED.2008.2008401

M3 - 文章

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SN - 0741-3106

VL - 30

SP - 11

EP - 13

JO - IEEE Electron Device Letters

JF - IEEE Electron Device Letters

IS - 1

ER -

Delamination and electromigration of film lines on polymer substrate under electrical loading

Abstract

Keywords

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