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D-Band Hairpin Filters Based on TGV Technology

  • Pengyang Lv
  • , Zhaoying Li
  • , Kaiyue Liu
  • , Liming Si
  • , Houjun Sun
  • , Lianggong Wen
  • , Xiue Bao*
  • *Corresponding author for this work
  • Beijing Institute of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper focuses on the design of a D-band hairpin filter based on Through-Glass Via (TGV) technology. As a essential part of the millimeter-wave band, the D band (110-170 GHz) has broad application prospects in fields such as 5G, 6G communications, radar systems, and high-resolution imaging. However, the high-frequency characteristics of the D band pose higher requirements for the design of radio-frequency (RF) devices. This paper first introduces the basic structure and working principle of the hairpin filter. Then, it elaborates on the design process of a seventh-order Chebyshev band-pass hairpin filter based on TGV technology. The structural parameters of the filter are optimized through a finite-element full-wave electromagnetic simulation platform to meet the performance requirements in the D band. In addition, a novel hairpin filter structure is proposed, in which a U-shaped hairpin structure is formed by hollowing out the ground to further improve the filter's performance. The simulation results show that the designed filter has good bandwidth characteristics and insertion loss characteristics in the D band, providing a high-performance filtering solution for high-frequency communications and radar systems.

Original languageEnglish
Title of host publication2025 IEEE 8th International Conference on Integrated Circuits, Technologies and Applications, ICTA 2025
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages192-193
Number of pages2
ISBN (Electronic)9798331571627
DOIs
StatePublished - 2025
Event2025 IEEE 8th International Conference on Integrated Circuits, Technologies, and Applications, ICTA2025 - Macao, China
Duration: 22 Oct 202524 Oct 2025

Publication series

Name2025 IEEE 8th International Conference on Integrated Circuits, Technologies and Applications, ICTA 2025

Conference

Conference2025 IEEE 8th International Conference on Integrated Circuits, Technologies, and Applications, ICTA2025
Country/TerritoryChina
CityMacao
Period22/10/2524/10/25

Keywords

  • Chebyshev filter
  • D band
  • Hairpin filter
  • RF device design
  • Through Glass Via (TGV) technology

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