Abstract
The creep behavior of directionally solidified superalloy IC10 was investigated at 760°C/750MPa and the deformation mechanism was studied. The results showed that anti-phase boundary (APB) and stacking fault (SF) were observed by using TEM, which indicated that the dislocations cutting through γ′ precipitates was the main creep deformation mechanism at 760°C. The morphology of cracks were observed by SEM, the cracks initiated from the interface between γ matrix and carbides, and extended along the direction normal to the applied stress.
| Original language | English |
|---|---|
| Pages (from-to) | 1-3+9 |
| Journal | Journal of Materials Engineering |
| Issue number | 1 |
| State | Published - Jan 2009 |
Keywords
- Anti-phase boundary
- Crack
- Creep
- Directionally solidification
- Stacking fault
Fingerprint
Dive into the research topics of 'Creep deformation mechanism of directionally solidified Ni3Al-base superalloy IC10 at 760°C'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver