Creep characterization of lead free 80Au-20Sn solder

Su Fei; Pan Haiyan

doi:10.1109/ICEPT.2009.5270656

Creep characterization of lead free 80Au-20Sn solder

Su Fei^*
, Pan Haiyan

^*Corresponding author for this work

School of Aeronautic Science and Engineering

Beihang University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

In this paper, steady-state creep behavior of lead free 80Au-20Sn solder was investigated at three different temperatures (i.e. 25°C, 75°C and 125°C) and a range of stress levels. Hyperbolic-Sine model was employed to characterize the creep properties of the lead free solder, constants in the model were determined through data fitting and were compared with that of other lead free solders.

Original language	English
Title of host publication	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages	718-721
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT.2009.5270656
State	Published - 2009
Event	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 - Beijing, China Duration: 10 Aug 2009 → 13 Aug 2009

Publication series

Name	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Conference

Conference	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Country/Territory	China
City	Beijing
Period	10/08/09 → 13/08/09

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10.1109/ICEPT.2009.5270656

Cite this

Fei, S., & Haiyan, P. (2009). Creep characterization of lead free 80Au-20Sn solder. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 (pp. 718-721). Article 5270656 (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009). https://doi.org/10.1109/ICEPT.2009.5270656

@inproceedings{7fe6827c387045088d70d3cbd4d1bc7e,

title = "Creep characterization of lead free 80Au-20Sn solder",

abstract = "In this paper, steady-state creep behavior of lead free 80Au-20Sn solder was investigated at three different temperatures (i.e. 25°C, 75°C and 125°C) and a range of stress levels. Hyperbolic-Sine model was employed to characterize the creep properties of the lead free solder, constants in the model were determined through data fitting and were compared with that of other lead free solders.",

author = "Su Fei and Pan Haiyan",

year = "2009",

doi = "10.1109/ICEPT.2009.5270656",

language = "英语",

isbn = "9781424446599",

series = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",

pages = "718--721",

booktitle = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",

note = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 ; Conference date: 10-08-2009 Through 13-08-2009",

}

Fei, S & Haiyan, P 2009, Creep characterization of lead free 80Au-20Sn solder. in 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009., 5270656, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, pp. 718-721, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Beijing, China, 10/08/09. https://doi.org/10.1109/ICEPT.2009.5270656

Creep characterization of lead free 80Au-20Sn solder. / Fei, Su; Haiyan, Pan.
2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. 2009. p. 718-721 5270656 (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - In this paper, steady-state creep behavior of lead free 80Au-20Sn solder was investigated at three different temperatures (i.e. 25°C, 75°C and 125°C) and a range of stress levels. Hyperbolic-Sine model was employed to characterize the creep properties of the lead free solder, constants in the model were determined through data fitting and were compared with that of other lead free solders.

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M3 - 会议稿件

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Y2 - 10 August 2009 through 13 August 2009

ER -

Creep characterization of lead free 80Au-20Sn solder

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