Abstract
Thermoelectric cooling technology has broad applications but is limited by the high cost of tellurium (Te) in commercially available Bi2Te3-based thermoelectric materials. Herein, a cost-effective symmetric PbSe-based device constructed from 7 pairs of Pb0.988Cu0.002Se (p-type) and Pb1.02Cu0.002Se (n-type) is presented, which demonstrates impressive cooling temperature difference (ΔTC) of 32.8 and 41.0 K with the hot side maintained at 303 and 343 K, respectively. This low-cost symmetric PbSe-based device exhibits superior cost-effectiveness (ΔT/cost) for near-room-temperature thermoelectric cooling compared to other Bi2Te3-based devices. Its high cooling performance primarily stems from an advanced carrier and phonon transport properties in p-type Pb0.988Cu0.002Se. Specifically, Pb vacancy and Cu substitution in Pb0.988Cu0.002Se act as strong p-type dopants that effectively optimize carrier density, resulting in a maximum power factor of 28.69 µW cm−1 K−2 at room temperature. Moreover, the mobile Cu atoms within the lattice significantly impede phonon propagation, leading to a low room-temperature lattice thermal conductivity of 1.10 W m−1 K−1. Finally, the room-temperature figure of merit (ZT) and average ZT value in p-type Pb0.988Cu0.002Se can reach 0.6 and 0.68 at 300–573 K, surpassing previous p-type PbSe-based polycrystals. This work emphasizes the significant potential of a cost-effective PbSe compound for near-room-temperature cooling applications.
| Original language | English |
|---|---|
| Article number | 2502705 |
| Journal | Advanced Materials |
| Volume | 37 |
| Issue number | 27 |
| DOIs | |
| State | Published - 10 Jul 2025 |
Keywords
- cooling temperature
- cost-effective PbSe
- power factor
- thermal conductivity
- thermoelectric cooling
Fingerprint
Dive into the research topics of 'Cost-Effective Symmetric PbSe-Based Device for Thermoelectric Cooling'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver