Construction of a 3D porous network of copper film via a templatefree deposition method with superior mechanical and electrical properties for micro-energy devices

With the ever increasing level of performance of energy conversion micro-devices, such as thin-film solar cells and thermoelectric micro-generators or coolers, their reliability and stability still remain a challenge. The high electrical and mechanical stability of an electrode is two of the critical factors that affect the long-term life of devices. Here we show that these factors can be achieved by constructing a 3D porous network of nanostructures in copper film using facile magnetron sputtering technology without any templates. The constructed 3D porous network of nanostructures in Cu film provides not only the advantages of light weight, prominently high conductivity, and large elastic deformation, but also the ability to absorb stress, preventing crack propagation, which is crucial for electrodes to maintain stable electrical and mechanical properties under working conditions. The nanopores inside the 3D network are capable of unrestrained deformation under applied stress resulting in strong elastic recovery. This work puts forward a feasible solution for manufacturing electrodes with excellent electrical and mechanical properties for micro-energy devices.